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| 國立成功大學 |
2016-03-21 |
Disruption of crystalline structure of Sn3.5Ag induced by electric current
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Huang, Han-Chie; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2015-12-01 |
High dislocation density of tin induced by electric current
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Liao, Yi-Han; Liang, Chien-Lung; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2015-10 |
In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates
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Hsu, Hsueh Hsien; Chen, Hao; Ouyang, Yao Tsung; Chiu, Tz Cheng; Chang, Tao Chih; Lee, Hsin Yi; Ku, Chin Shun; Wu, Albert T. |
| 國立成功大學 |
2015-01-15 |
The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing
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He, Jian-Yang; Lin, Kwang-Lung; Wu, Albert T. |
| 國立交通大學 |
2014-12-08T15:14:37Z |
Stress analysis of spontaneous Sn whisker growth
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Tu, K. N.; Chen, Chih; Wu, Albert T. |
| 國立成功大學 |
2014-01 |
Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis
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Hsu, Hsueh-Hsien; Chiu, Tz-Cheng; Chang, Tao-Chih; Huang, Shin-Yi; Lee, Hsin-Yi; Ku, Ching-Shun; Lin, Yang-Yi; Su, Chien-Hao; Chou, Li-Wei; Ouyang, Yao-Tsung; Huang, Yi-Ting; Wu, Albert T. |
| 國立成功大學 |
2013-03 |
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
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Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lee, Hsin-Yi |
| 國立成功大學 |
2013-02-05 |
Electrorecrystallization of Metal Alloy
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Chiu, Ying-Ta; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lai, Yi-Shao |
| 國立臺灣大學 |
2007 |
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
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Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N. |
Showing items 1-9 of 9 (1 Page(s) Totally)
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