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Showing items 61-63 of 63  (7 Page(s) Totally)
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Institution Date Title Author
臺北醫學大學 2003 Effects of nitrogen plasma treatment on tantalum diffusion barriers in copper metallization Wu,Wen-Fa; Ou,Keng-Liang; Chou,Chang-Pin; Wu,Chi-Chang
臺北醫學大學 2002 Improved TaN Barrier Layer Against Cu Diffusion by Formation of an Amorphous Layer Using Plasma Treatment Ou,Keng-Liang; Wu,Wen-Fa; Chou,Chang-Pin; Chiou,Shi-Yung; Wu,Chi-Chang
臺北醫學大學 2001 Barrier Capability of TaNx Films Deposited by Different Nitrogen Flow Rate Against Cu Diffusion in Cu/TaNx/n+-p Junction Diodes Yang,Wen-Luh; Wu,Wen-Fa; Liu,Don-Gey; Wu,Chi-Chang; Ou,Keng Liang

Showing items 61-63 of 63  (7 Page(s) Totally)
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