|
"wu chung hsi"的相关文件
显示项目 1-4 / 4 (共1页)
1
每页显示[10|25|50]项目
| 國立交通大學 |
2016-03-28T00:05:44Z |
Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
|
Chang, Chih-Wei; Huang, Po-Tsang; Chou, Lei-Chun; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Lee, Yen-Chi; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming |
| 國立交通大學 |
2015-12-02T03:00:57Z |
Integrated Microprobe Array and CMOS MEMS by TSV Technology for Bio- Signal Recording Application
|
Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Wu, Shang-Lin; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T03:00:54Z |
A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe Array
|
Chou, Lei-Chun; Lee, Shih-Wei; Cheng, Chuan-An; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:05Z |
A TSV-Based Bio-Signal Package With mu-Probe Array
|
Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
显示项目 1-4 / 4 (共1页)
1
每页显示[10|25|50]项目
|
