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"wu enboa"的相关文件
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| 國立臺灣大學 |
2006 |
Modeling white light-emitting diodes with phosphor layers
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Kang, Dun-Yen; Wu, Enboa; Wang, Da-Ming |
| 國立臺灣大學 |
2006 |
Mechanical properties of intermetallic compounds on lead-free solder by moir? techniques
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Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H. |
| 臺大學術典藏 |
2006 |
Modeling white light-emitting diodes with phosphor layers
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Wang, Da-Ming; Wu, Enboa; Kang, Dun-Yen; Kang, Dun-Yen; Wu, Enboa; Wang, Da-Ming |
| 臺大學術典藏 |
2006 |
Mechanical properties of intermetallic compounds on lead-free solder by Moire techniques
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Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2005-06 |
Mechanical behavior of flip chip packages under thermal loading
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Chen, Shoulung; Tsai, C.Z.; Kao, Nicholas; Wu, Enboa |
| 國立臺灣大學 |
2005-03 |
A highly efficient thermally controlled loss-tunable long-period fiber grating on corrugated metal substrate
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Wu, Enboa; Yang, Rou-Ching; San, Kuo-Ching; Lin, Chien-Hung; Alhassen, Fares; Lee, H.P. |
| 國立臺灣大學 |
2004-06 |
How to improve chip strength to avoid die cracking in a package
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Chen, Shoulung; Shih, I.G.; Chen, Y.N.; Tsai, C.Z.; Lin, J.W.; Wu, Enboa |
| 國立臺灣大學 |
2004-06 |
Simultaneously determining Young's modulus, coefficient of thermal expansion, Poisson ratio and thickness of thin films on silicon wafer
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Wu, Enboa; Yang, A.J.D.; Shao, Ching-An |
| 國立臺灣大學 |
2002-05 |
Influence of grinding process on semiconductor chip strength
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Wu, Enboa; Shih, I.G.; Chen, Y.N.; Chen, S.C.; Tsai, C.Z.; Shao, C.A. |
| 國立臺灣大學 |
1994 |
Physiological Patellofemoral Crepitus in Knee Disorder
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江清泉; 劉益瑞; 葉建文; 吳恩柏; 傅式恩; JIANG, CHING-CHUAN; LIU, YI-JUI; YIP, KIM -MAN; WU, ENBOA; FU, SHIN-EN |
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