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機構 日期 題名 作者
淡江大學 2024-03-03 Effects of Storage Time on the Growth of Cu(In,Sn)2 Chang, K.C.;Wu, G.W.;Wang, Y.W.
淡江大學 2024-01-03T04:05:40Z Low-temperature solder for low-carbon emitting process Wang, Y. W.;Liang, H. T.;Tseng, T. T.;Wu, G. W.
臺大學術典藏 2022-03-22T08:28:45Z Precise 3-D microscopic profilometry using diffractive image microscopy and artificial neural network in single-exposure manner Wu G.-W;Chen L.-C.; Wu G.-W; Chen L.-C.; LIANG-CHIA CHEN
臺大學術典藏 2022-03-22T08:28:45Z Precise 3-D microscopic profilometry using diffractive image microscopy and artificial neural network in single-exposure manner Wu G.-W;Chen L.-C.; Wu G.-W; Chen L.-C.; LIANG-CHIA CHEN
臺大學術典藏 2022-03-22T08:28:45Z High-speed chromatic confocal microscopy using multispectral sensors for sub-micrometer-precision microscopic surface profilometry Chen L.-C;Tan P.-J;Wu G.-W;Lin C.-J;Nguyen D.T.; Chen L.-C; Tan P.-J; Wu G.-W; Lin C.-J; Nguyen D.T.; LIANG-CHIA CHEN
臺大學術典藏 2022-03-22T08:28:45Z High-speed chromatic confocal microscopy using multispectral sensors for sub-micrometer-precision microscopic surface profilometry Chen L.-C;Tan P.-J;Wu G.-W;Lin C.-J;Nguyen D.T.; Chen L.-C; Tan P.-J; Wu G.-W; Lin C.-J; Nguyen D.T.; LIANG-CHIA CHEN
臺大學術典藏 2022-03-22T08:25:58Z High-speed chromatic confocal microscopy using multispectral sensors for sub-micrometer-precision microscopic surface profilometry Chen L.-C;Tan P.-J;Wu G.-W;Lin C.-J;Nguyen D.T.; Chen L.-C; Tan P.-J; Wu G.-W; Lin C.-J; Nguyen D.T.; LIANG-CHIA CHEN
臺大學術典藏 2022-03-22T08:25:57Z Precise 3-D microscopic profilometry using diffractive image microscopy and artificial neural network in single-exposure manner Wu G.-W;Chen L.-C.; Wu G.-W; Chen L.-C.; LIANG-CHIA CHEN
淡江大學 2021-11-13 Microstructural Evolution of Low-Temperature Solder Joints Tseng, T.T.;Wu, G.W.;Liang, H.T.;Wang, Y.W.
臺大學術典藏 2021-07-16T06:18:14Z Microbiological transformation of diosgenin by resting cells of filamentous fungus, Cunninghamella echinulata CGMCC 3.2716 Dong T.; Wu G.-W.; Wang X.-N.; Gao J.-M.; Chen J.-G.; SHOEI-SHENG LEE

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