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機構 日期 題名 作者
國立成功大學 2008-02 Optimizing maximum equivalent strain on solder balls in flip-chip packages Wu, Gien-Huang; Ju, Shen-Haw; Hsu, T. C.; Lai, Hsin-Yi; Hwang, Wen-Miin
國立成功大學 2007 Thermal study of enhanced plastic ball grid array package with flat heat spreader Huang, T. P.; Wu, Gien-Huang
國立成功大學 2005-08 The creeping flow of a polymeric fluid through bent square ducts with heat dissipation Wu, Gien-Huang
國立成功大學 2005 Three-dimensional finite element analysis of thermomechanical behavior in flip-chip packages under temperature cycling conditions Wu, Gien-Huang; Tsein, T. C.; Ju, Shen-Haw
國立成功大學 2004-07-27 Non-isothermal flow of a polymeric liquid through rounded rectangular ducts Wu, Gien-Huang
國立成功大學 2004-04 Modeling and simulation of the hole pressure problem Wu, Gien-Huang; Ju, Shen-Haw; Wu, C. C.
國立成功大學 2004-04 Non-isothermal flow of a polymeric liquid passing an asymmetrically confined cylinder Lin, Y. M.; Wu, Gien-Huang; Ju, Shen-Haw
國立成功大學 2003-11 Non-isothermal flow of a polymeric fluid past a submerged circular cylinder Wu, Gien-Huang; Wu, B. Y.; Ju, Shen-Haw; Wu, C. C.
國立成功大學 2003-09 Non-isothermal flow of a polymeric liquid through rounded L-channels Wu, Gien-Huang; Lin, M. C.; Ju, Shen-Haw; Wu, C. C.
國立成功大學 2002-11 Creeping flow of a polymeric liquid passing over a transverse slot with viscous dissipation Wu, Gien-Huang; Lin, Y. M.

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