|
English
|
正體中文
|
简体中文
|
Total items :2822964
|
|
Visitors :
30127852
Online Users :
691
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"wu hsing fei"
Showing items 1-4 of 4 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立臺灣大學 |
2011 |
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
|
Chuang, Tung-Han; Wu, Hsing-Fei |
| 臺大學術典藏 |
2011 |
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
|
Wu, Hsing-Fei; Chuang, Tung-Han; Chuang, Tung-Han; Wu, Hsing-Fei |
| 臺大學術典藏 |
2009-01-06T01:25:25Z |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
|
Chuang, Tung-Han; Chiang, Ming-Jui; Wu, Hsing-Fei; Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
| 國立臺灣大學 |
2004 |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
|
Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
Showing items 1-4 of 4 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
