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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"wu hsing fei"的相關文件
顯示項目 1-4 / 4 (共1頁)
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| 國立臺灣大學 |
2011 |
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
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Chuang, Tung-Han; Wu, Hsing-Fei |
| 臺大學術典藏 |
2011 |
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
|
Wu, Hsing-Fei; Chuang, Tung-Han; Chuang, Tung-Han; Wu, Hsing-Fei |
| 臺大學術典藏 |
2009-01-06T01:25:25Z |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
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Chuang, Tung-Han; Chiang, Ming-Jui; Wu, Hsing-Fei; Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
| 國立臺灣大學 |
2004 |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
|
Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
顯示項目 1-4 / 4 (共1頁)
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