|
English
|
正體中文
|
简体中文
|
2822954
|
|
???header.visitor??? :
30126271
???header.onlineuser??? :
646
???header.sponsordeclaration???
|
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"wu hsing fei"???jsp.browse.items-by-author.description???
Showing items 1-4 of 4 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立臺灣大學 |
2011 |
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
|
Chuang, Tung-Han; Wu, Hsing-Fei |
| 臺大學術典藏 |
2011 |
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
|
Wu, Hsing-Fei; Chuang, Tung-Han; Chuang, Tung-Han; Wu, Hsing-Fei |
| 臺大學術典藏 |
2009-01-06T01:25:25Z |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
|
Chuang, Tung-Han; Chiang, Ming-Jui; Wu, Hsing-Fei; Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
| 國立臺灣大學 |
2004 |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
|
Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
Showing items 1-4 of 4 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
