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"wu ic wu i chih"???jsp.browse.items-by-author.description???
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| 中國文化大學 |
2018-01 |
Experimental location of damage in microelectronic solder joints after a board level reliability evaluation
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Wu, IC (Wu, I-Chih); Wang, MH (Wang, Min-Haw); Jang, LS (Jang, Ling-Sheng) |
| 中國文化大學 |
2018 |
Characteristics of Lock-in Thermography Signal from Solder Bump Cracking in Wafer-level Chip Scale Packaging for Internet of Things Applications
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Wu, IC (Wu, I-Chih); Huang, YJ (Huang, Yu-Jung); Wang, MH (Wang, Min-Haw); Jang, LS (Jang, Ling-Sheng) |
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