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Showing items 16-25 of 35 (4 Page(s) Totally) << < 1 2 3 4 > >> View [10|25|50] records per page
| 國立政治大學 |
2011-06 |
Sarcosine therapy for obsessive compulsive disorder: A prospective, open-label study
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Wu, P.-L.;Tang, Hwa-Sheng;Lane, H.-Y.;Tsai, C.-A.;Tsai, G.E.; 湯華盛 |
| 淡江大學 |
2009-11 |
Lack of association between AKT1 variances versus clinical manifestations and social function in patients with schizophrenia
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Liu, Yi-Ching; Huang, C.L.; Wu, P.L.; Chang, Y.C.; Huang, C.H.; Lane, Hsien-Yuan |
| 臺大學術典藏 |
2007 |
Energy-efficient and performance-enhanced disks using flash-memory cache
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Hsieh, J.-W.;Kuo, T.-W.;Wu, P.-L.;Huang, Y.-C.; Hsieh, J.-W.; Kuo, T.-W.; Wu, P.-L.; Huang, Y.-C.; TEI-WEI KUO |
| 國立臺灣科技大學 |
2005 |
The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
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Huang, M.K.;Lee, C.;Wu, P.L.;Tzan, S.R. |
| 臺大學術典藏 |
2005 |
Seroprevalence of SARS coronavirus antibody in household contacts
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Chang S.-C.; Huang L.-M.; Chen W.-J.; Wu P.-L.; Lu T.-C.; Tsai P.-C.; Chang I.-J.; Chen S.-Y.; CHIEN-CHANG LEE; Chang S.-C.;Huang L.-M.;Chen W.-J.;Wu P.-L.;Lu T.-C.;Tsai P.-C.;Chang I.-J.;Chen S.-Y.;CHIEN-CHANG LEE |
| 臺大學術典藏 |
2005 |
Seroprevalence of SARS coronavirus antibody in household contacts
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Tsai P.-C.; Chang I.-J.; Chen S.-Y.; Lee C.-C.; Lee C.-C.;Chen S.-Y.;Chang I.-J.;Tsai P.-C.;Tsung-Chien Lu;Wu P.-L.;Chen W.-J.;Huang L.-M.;Chang S.-C.; Chang S.-C.; Huang L.-M.; Chen W.-J.; Wu P.-L.; TSUNG-CHIEN LU |
| 臺大學術典藏 |
2005 |
Seroprevalence of SARS coronavirus antibody in household contacts
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Lee C.-C.;Chen S.-Y.;Chang I.-J.;Tsai P.-C.;Lu T.-C.;Wu P.-L.;Wen-Jone Chen;Huang L.-M.;Chang S.-C.; Lee C.-C.; Chen S.-Y.; Chang I.-J.; Tsai P.-C.; Lu T.-C.; Wu P.-L.; WEN-JONE CHEN; Huang L.-M.; Chang S.-C. |
| 國立臺灣科技大學 |
2004 |
Effects of different printed circuit board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued small outline J leads/Sn-Pb interfaces
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Huang, M.K.;Wu, P.L.;Lee, C. |
| 國立臺灣科技大學 |
2004 |
Failure behavior of small outline J lead/Sn-X (X = AgCu or Pb) solder joints under thermomechanical fatigue test
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Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R. |
| 國立臺灣科技大學 |
2004 |
Effects of printed circuit board surface finish and thermomechanical fatigue on the microstructure and mechanical strength of small outline J leads/Sn-X (X = AgCu and Pb) solder joints
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Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R. |
Showing items 16-25 of 35 (4 Page(s) Totally) << < 1 2 3 4 > >> View [10|25|50] records per page
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