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Showing items 256-265 of 495 (50 Page(s) Totally)
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| 國立臺灣大學 |
2011 |
Crystallization temperature and activation energy of as-spun Ti52.0Ni38.5Cu9.5 ribbon
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Chang, K.H.; Wu, S.K.; Chang, S.H. |
| 國立臺灣大學 |
2011 |
Low-frequency damping properties of eutectic Sn-Bi and In-Sn solders
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Chang, S.H.; Wu, S.K. |
| 國立臺灣大學 |
2010-12 |
Multi-stage Transformation in Annealed Ni-rich Ti49Ni41Cu10 Shape Memory Alloy
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Wu, S.K.; Lin, K. N. |
| 國立臺灣大學 |
2010-12 |
Infrared Brazing Fe3Al Intermetallics Using the Cu Filler Metal
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Li, Y.; Shiue, R. K.; Wu, S.K.; Wu, L. M. |
| 國立臺灣大學 |
2010-12 |
Strong Bonding of Infrared Brazed α2-Ti3Al and Ti-6Al-4V using Ti-Cu-Ni Fillers
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Shiue, R. K.; Chen, Y. T.; Wu, S.K. |
| 國立臺灣大學 |
2010-12 |
Martensitic Transformation of Ni64Al34Re2 Shape Memory Alloy
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Kang, H. J.; Wu, L. M.; Wu, S. K. |
| 國立臺灣大學 |
2010 |
Damping characteristics of Sn-3Ag-0.5Cu and Sn-37Pb solders studied by dynamic mechanical analysis
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Chang, S.H.; Wu, S.K. |
| 國立臺灣大學 |
2010 |
Shape memory characteristics of as-spun and annealed Ti51Ni49 crystalline ribbons
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Chang, S.H.; Wu, S.K.; Wu, L.M. |
| 國立臺灣大學 |
2010 |
Damping characteristics of the Ti-rich TiNi melt-spun ribbon measured by using a dynamic mechanical analyzer
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Chang, S.H.; Chen, T.H.; Wu, S.K.; Lin, K.N. |
| 臺大學術典藏 |
2010 |
Strong bonding of infrared brazed α2-Ti3Al and Ti-6Al-4V using Ti-Cu-Ni fillers
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Wu, S.K.;Chen, Y. T.;SHYI-KAAN WU;Shiue, R. K.;Chen, Y.T.;Wu, S.K.;Shiue, R.K.;Wu, S.K.;Chen, Y. T.;Shiue, R. K.;Wu, S.K.;Chen, Y. T.;SHYI-KAAN WU;Shiue, R. K.; Shiue, R. K.; Chen, Y. T.; Wu, S.K.; Shiue, R.K.; Wu, S.K.; Chen, Y.T.; Shiue, R. K.; SHYI-KAAN WU; Chen, Y. T.; Wu, S.K. |
Showing items 256-265 of 495 (50 Page(s) Totally)
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