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| 國立成功大學 |
2022-06-20 |
探討影響Podcast用戶持續使用與推薦意願之因素：結合推敲可能性模型和使用與滿足理論
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吳威澄; Wu, Wei-Cheng |
| 國立成功大學 |
2021-02-04 |
鋼構實驗屋之鋼承複合樓版與小梁於相關火害實驗之結構行為研究
|
吳偉丞; Wu, Wei-Cheng |
| 朝陽科技大學 |
2016 |
亨利定律在液態發酵之應用
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吳偉丞; Wu, Wei-Cheng |
| 國立交通大學 |
2014-12-16T06:15:45Z |
Vertical Transmission Structure
|
Chang, Edward Yi; Wu, Wei-Cheng; Hwang, Ruey-Bing; Hsu, Li-Han |
| 國立交通大學 |
2014-12-16T06:15:32Z |
High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof
|
Chang, Edward-yi; Hsu, Li-Han; Oil, Chee-Way; Wu, Wei-Cheng; Wang, Chin-te |
| 國立交通大學 |
2014-12-16T06:15:24Z |
HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
|
Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-16T06:14:20Z |
Vertical transmission line structure that includes bump elements for flip-chip mounting
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Chang Edward Yi; Wu Wei-Cheng; Hwang Ruey-Bing; Hsu Li-Han |
| 國立交通大學 |
2014-12-16T06:14:18Z |
High frequency flip chip package process of polymer substrate and structure thereof
|
Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-16T06:14:14Z |
Vertical transmission line structure that includes bump elements for flip-chip mounting
|
Chang Edward Yi; Wu Wei-Cheng; Hwang Ruey-Bing; Hsu Li-Han |
| 國立交通大學 |
2014-12-08T15:48:37Z |
Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent Reliability
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Hsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping |
Showing items 1-10 of 24 (3 Page(s) Totally)
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