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"wu wen fa"的相关文件
显示项目 46-55 / 68 (共7页)
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| 國立交通大學 |
2014-12-08T15:07:20Z |
Effect of strain relaxation of oxidation-treated SiGe epitaxial thin films and its nanomechanical characteristics
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He, Bo-Ching; Wen, Hua-Chiang; Chinag, Tun-Yuan; Chang, Zue-Chin; Lian, Derming; Yau, Wei-Hung; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立交通大學 |
2014-12-08T15:07:14Z |
Nanoindentation characterization of GaN epilayers on A-plane sapphire substrates
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Lin, Meng-Hung; Wen, Hua-Chiang; Huang, Chih-Yung; Jeng, Yeau-Ren; Yau, Wei-Hung; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立交通大學 |
2014-12-08T15:06:56Z |
Observation of Growth of Human Fibroblasts on Silver Nanoparticles
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Wen, Hua-Chiang; Lin, Yao-Nan; Jian, Sheng-Rui; Tseng, Shih-Chun; Weng, Ming-Xiang; Liu, Yu-Pin; Lee, Po-Te; Chen, Pai-Yen; Hsu, Ray-Quan; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立交通大學 |
2014-12-08T15:06:46Z |
Effect of annealing treatment and nanomechanical properties for multilayer Si(0.8)Ge(0.2)-Si films
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He, Bo-Ching; Wen, Hua-Chiang; Lin, Meng-Hung; Lai, Yi-Shao; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立交通大學 |
2014-12-08T15:06:06Z |
Effects of capping layers on the electrical characteristics of nickel silicided junctions
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Wu, Chi-Chang; Wu, Wen-Fa; Su, P. Y.; Chen, L. J.; Ko, Fu-Hsiang |
| 亞洲大學 |
2008 |
Stress-induced morphology and fine-line stability enhancement of NiSi on poly-SiGe with a buffer polycrystalline silicon interlayer
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Wu, Chi-Chang ; Wu, Wen-Fa ; Ko, Fu-Hsiang ; You, Hsin-Chiang ; Yang, Wen-Luh |
| 國立臺灣大學 |
2008 |
Increasing mechanical strength of mesoporous silica thin films by addition of tetrapropylammonium hydroxide and refluxing processes
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Tsai, Cheng-Tsung; Lu, Hsin-Yan; Ting, Chih-Yuan; Wu, Wen-Fa; Wan, Ben-Zu |
| 國立高雄應用科技大學 |
2007 |
Enhancing the reliability of n+–p junction diodes using plasma treated tantalum barrier film
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Ou, Keng-Liang; Wu, Wen-Fa; Chiou, Shi-Yung |
| 臺北醫學大學 |
2007 |
Enhancing the reliability of n(+)-p junction diodes using plasma treated tantalum barrier film
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歐耿良; Ou,Keng-Liang; Wu,Wen-Fa; Chiou,Shi-Yung |
| 國立臺灣大學 |
2007 |
The roles of hydrophobic group on the surface of ultra low dielectric constant porous silica film during thermal treatment
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Luo, Jen-Tsung; Wu, Wen-Fa; Wen, Hua-Chiang; Wan, Ben-Zu; Chang, Yu-Ming; Chou, Chang-Pin; Chen, Jun-Ming; Chen, Wu-Nan |
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