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"wu wen fa"的相关文件
显示项目 56-65 / 68 (共7页) << < 1 2 3 4 5 6 7 > >> 每页显示[10|25|50]项目
| 國立臺灣大學 |
2007 |
Porosity Effects on Properties of Mesoporous Silica Low-k Films Prepared Using Tetraethylorthosilicate with Different Templates
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Ting, Chih-Yuan; Sheu, Hwo-Shuenn; Wu, Wen-Fa; Wana, Ben-Zu |
| 國立臺灣大學 |
2007 |
Reinforcing Porous Silica with Carbon Nanotubes to Enhance Mechanical Performance
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Luo, Jen-Tsung; Wen, Hua-Chiang; Chou, Chang-Pin; Wu, Wen-Fa; Wan, Ben-Zu |
| 國立高雄應用科技大學 |
2005 |
Carbon nanotubes grown using cobalt silicide as catalyst and hydrogen pretreatment
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Wen, Hua-Chiang; Yang, Koho; Ou, Keng-Liang; Wu, Wen-Fa; Luo, Ren-Chon; Chou, Chang-Pin |
| 臺北醫學大學 |
2005 |
Carbon nanotubes grown using cobalt silicide as catalyst and hydrogen pretreatment
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Wen,Hua-Chiang; Yang,Koho; Ou,Keng-Liang; Wu,Wen-Fa; Luo,Ren-Chon; Chou,Chang-Pin |
| 臺北醫學大學 |
2005 |
Novel Multilayered Ti/TiN Barrier for Al Metallization
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歐耿良; Wu,Wen-Fa; Tsai,Kou-Chiang; Chao,Chuen-Guang; Chen,Jen-Chung; Ou,Keng-Liang |
| 臺北醫學大學 |
2005 |
Reliability of Multistacked Tantalum-based Structure as the Barrier Film in Ultralarge Scale Integrated Metallization
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歐耿良; Ou,Keng-Liang; Wu,Chi-Chang; Hsu,Chiung-Chi; Chen,Chin-Sung; Shyng,Yih-Chuen; Wu,Wen-Fa |
| 臺北醫學大學 |
2003 |
Effects of nitrogen plasma treatment on tantalum diffusion barriers in copper metallization
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Wu,Wen-Fa; Ou,Keng-Liang; Chou,Chang-Pin; Wu,Chi-Chang |
| 臺北醫學大學 |
2003 |
PECVD-Ti/TiNx barrier with multilayered amorphous structure and high thermal stability for copper metallization
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Wu,Wen-Fa; Ou,Keng-Liang; Chou,Chang-Pin; Hsua,Jwo-Lun |
| 國立臺灣大學 |
2003 |
Low Dielectric Constant Silica Films Prepared by a Templating Method
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Ting, Chih-Yuan; Wu, Chen-An; Wan, Ben-Zu; Wu, Wen-Fa |
| 臺北醫學大學 |
2002 |
Improved TaN Barrier Layer Against Cu Diffusion by Formation of an Amorphous Layer Using Plasma Treatment
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Ou,Keng-Liang; Wu,Wen-Fa; Chou,Chang-Pin; Chiou,Shi-Yung; Wu,Chi-Chang |
显示项目 56-65 / 68 (共7页) << < 1 2 3 4 5 6 7 > >> 每页显示[10|25|50]项目
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