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Showing items 56-65 of 68  (7 Page(s) Totally)
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Institution Date Title Author
國立臺灣大學 2007 Porosity Effects on Properties of Mesoporous Silica Low-k Films Prepared Using Tetraethylorthosilicate with Different Templates Ting, Chih-Yuan; Sheu, Hwo-Shuenn; Wu, Wen-Fa; Wana, Ben-Zu
國立臺灣大學 2007 Reinforcing Porous Silica with Carbon Nanotubes to Enhance Mechanical Performance Luo, Jen-Tsung; Wen, Hua-Chiang; Chou, Chang-Pin; Wu, Wen-Fa; Wan, Ben-Zu
國立高雄應用科技大學 2005 Carbon nanotubes grown using cobalt silicide as catalyst and hydrogen pretreatment Wen, Hua-Chiang; Yang, Koho; Ou, Keng-Liang; Wu, Wen-Fa; Luo, Ren-Chon; Chou, Chang-Pin
臺北醫學大學 2005 Carbon nanotubes grown using cobalt silicide as catalyst and hydrogen pretreatment Wen,Hua-Chiang; Yang,Koho; Ou,Keng-Liang; Wu,Wen-Fa; Luo,Ren-Chon; Chou,Chang-Pin
臺北醫學大學 2005 Novel Multilayered Ti/TiN Barrier for Al Metallization 歐耿良; Wu,Wen-Fa; Tsai,Kou-Chiang; Chao,Chuen-Guang; Chen,Jen-Chung; Ou,Keng-Liang
臺北醫學大學 2005 Reliability of Multistacked Tantalum-based Structure as the Barrier Film in Ultralarge Scale Integrated Metallization 歐耿良; Ou,Keng-Liang; Wu,Chi-Chang; Hsu,Chiung-Chi; Chen,Chin-Sung; Shyng,Yih-Chuen; Wu,Wen-Fa
臺北醫學大學 2003 Effects of nitrogen plasma treatment on tantalum diffusion barriers in copper metallization Wu,Wen-Fa; Ou,Keng-Liang; Chou,Chang-Pin; Wu,Chi-Chang
臺北醫學大學 2003 PECVD-Ti/TiNx barrier with multilayered amorphous structure and high thermal stability for copper metallization Wu,Wen-Fa; Ou,Keng-Liang; Chou,Chang-Pin; Hsua,Jwo-Lun
國立臺灣大學 2003 Low Dielectric Constant Silica Films Prepared by a Templating Method Ting, Chih-Yuan; Wu, Chen-An; Wan, Ben-Zu; Wu, Wen-Fa
臺北醫學大學 2002 Improved TaN Barrier Layer Against Cu Diffusion by Formation of an Amorphous Layer Using Plasma Treatment Ou,Keng-Liang; Wu,Wen-Fa; Chou,Chang-Pin; Chiou,Shi-Yung; Wu,Chi-Chang

Showing items 56-65 of 68  (7 Page(s) Totally)
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