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Taiwan Academic Institutional Repository >
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"wu wf"
Showing items 6-15 of 38 (4 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:44:19Z |
Barrier capability of TaNx films deposited by different nitrogen flow rate against Cu diffusion in Cu/TaNx/n(+)-p junction diodes
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Yang, WL; Wu, WF; Liu, DG; Wu, CC; Ou, KL |
| 國立交通大學 |
2014-12-08T15:42:32Z |
Preventing dielectric damage of low-k organic siloxane by passivation treatment
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Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Mei, YJ; Pan, FM; Wu, WF; Sze, SM |
| 國立交通大學 |
2014-12-08T15:42:26Z |
Effect of the tantalum barrier layer on the electromigration and stress migration resistance of physical-vapor-deposited copper interconnect
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Chin, YL; Chiou, BS; Wu, WF |
| 國立交通大學 |
2014-12-08T15:42:15Z |
Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment
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Chang, TC; Liu, PT; Mor, YS; Tsai, TM; Chen, CW; Mei, YJ; Pan, FM; Wu, WF; Sze, SM |
| 國立交通大學 |
2014-12-08T15:42:14Z |
Effective repair to ultra-low-k dielectric material (k-2.0) by hexamethyidisilazane treatment
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Mor, YS; Chang, TC; Liu, PT; Tsai, TM; Chen, CW; Yan, ST; Chu, CJ; Wu, WF; Pan, FM; Lur, W; Sze, SM |
| 國立交通大學 |
2014-12-08T15:42:00Z |
Improved TaN barrier layer against Cu diffusion by formation of an amorphous layer using plasma treatment
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Ou, KL; Wu, WF; Chou, CP; Chiou, SY; Wu, CC |
| 國立交通大學 |
2014-12-08T15:41:47Z |
Improving the electrical integrity of Cu-CoSi2 contacted n(+)p junction diodes using nitrogen-incorporated Ta films as a diffusion barrier
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Yang, WL; Wu, WF; You, HC; Ou, KL; Lei, TF; Chou, CP |
| 國立交通大學 |
2014-12-08T15:41:21Z |
Effects of nitrogen plasma treatment on tantalum diffusion barriers in copper metallization
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Wu, WF; Ou, KL; Chou, CP; Wu, CC |
| 國立交通大學 |
2014-12-08T15:41:19Z |
PECVD-Ti/TiNx barrier with multilayered amorphous structure and high thermal stability for copper metallization
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Wu, WF; Ou, KL; Chou, CP; Hsu, JL |
| 國立交通大學 |
2014-12-08T15:39:18Z |
Influence of N2O plasma treatment on microstructure and thermal stability of WNx barriers for Cu interconnection
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Tsai, KC; Wu, WF; Chen, JC; Pan, TJ; Chao, CG |
Showing items 6-15 of 38 (4 Page(s) Totally)
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