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"wu yii der"
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| 國立高雄第一科技大學 |
2008.01 |
Experimental and statistical study in adhesion features of bonded interfaces of IC packages
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Chien, Chi-Hui;Chen, Thaiping;Lin, Wei-Bang;Hsieh, Chi-Chang;Wu, Yii-Der;Yeh, Cheng-Hsiu; 謝其昌 |
| 國立高雄第一科技大學 |
2007.07 |
Quantitative Detection of Internal Defects in Automotive Tires by an Interferographic Technique
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Chien, Chi-Hui;Wu, Yii-Der;Chen, Yung-Chang;Hsieh, Chi-Chang;Chen, Thaiping;Chiou, Yii-Tay;Tsai, Ming-Lang;Wang, Chung-Ting;Lin, Si-Lin;Chen, Wen-Fei; 謝其昌 |
| 國立高雄第一科技大學 |
2006.07 |
Stability of the warpage in a PBGA package subjected to hygro-thermal loading
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Chien, Chi-Hui;Chen, Thaiping;Chen, Yung-Chang;Chiou, Yii-Tay;Hsieh, Chi-Chang;Wu, Yii-Der; 謝其昌 |
| 國立高雄第一科技大學 |
2003.01 |
Influences of the moisture absorption on PBGA package’s warpage during IR reflow process
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Chien, Chi-Hui;Chen, Yung-Chang;Chiou, Yii-Tay;Chen, Thaiping;Hsieh, Chi-Chang;Yan, Jia-Jin;Chen, Wei-Zhi;Wu, Yii-Der; 謝其昌 |
| 中原大學 |
1998 |
含表面裂紋平板之疲勞裂紋成長模擬分析
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吳以德; WU YII-DER |
Showing items 1-5 of 5 (1 Page(s) Totally)
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