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| 臺大學術典藏 |
2020-01-13T08:23:10Z |
Real time monitoring of thickness of silicon membrane during wet etching using a novel surface acoustic wave sensor
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Lee, C.-Y.; Wu, T.-T.; Chen, Y.-Y.; Cheng, Y.-C.; Chen, W.-J.; Pao, S.-Y.; Chang, P.-Z.; Chen, P.-H.; Yen, K.-H.; Xiao, F.-Y.; PING-HEI CHEN |
| 臺大學術典藏 |
2018-09-10T04:49:51Z |
A novel method for evaluating the thickness of silicon membrane using a micromachined acoustic wave sensor
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Yen, K.-H.; Xiao, F.-Y.; PING-HEI CHEN; Chen, P.-H.; PING-HEI CHEN;Xiao, F.-Y.;Yen, K.-H.;Chen, P.-H.;Chang, P.-Z.;Pao, S.-Y.;Chen, W.-J.;Chen, Y.-Y.;Wu, T.-T.;Cheng, Y.-C.;Lee, C.-Y.;PING-HEI CHEN; Lee, C.-Y.; Cheng, Y.-C.; Wu, T.-T.; Chen, Y.-Y.; Chen, W.-J.; Pao, S.-Y.; Chang, P.-Z. |
| 臺大學術典藏 |
2018-09-10T04:49:49Z |
Real time monitoring of thickness of silicon membrane during wet etching using a novel surface acoustic wave sensor
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Lee, C.-Y.; Wu, T.-T.; Chen, Y.-Y.; Cheng, Y.-C.; Chen, W.-J.; Pao, S.-Y.; Chang, P.-Z.; Chen, P.-H.; Yen, K.-H.; Xiao, F.-Y.; PING-HEI CHEN |
| 臺大學術典藏 |
2018-09-10T04:29:38Z |
In-situ monitoring of thickness of quartz membrane during batch chemical etching using a novel micromachined acoustic wave sensor
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Wu, T.-T.; Chen, Y.-Y.; Pao, S.-Y.; Chen, W.-J.; Cheng, Y.-C.; Chang, P.-Z.; Chen, P.-H.; Lee, C.-K.; Dai, C.-L.; Yang, L.-J.; Yen, K.-S.; Xiao, F.-Y.; Liu, C.-W.; Lu, S.-S.; Lee, C.-Y.; PING-HEI CHENet al. |
| 國立臺灣大學 |
2004 |
A Novel Method for Evaluating the Thickness of Silicon Membrane Using a Micromachined Acoustic Wave Sensor
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Lee, C.-Y.; Cheng, Y.-C.; Wu, T.-T.; Chen, Y.-Y.; Chen, W.-J.; Pao, S.-Y.; Chang, P.-Z.; Chen, P.-H.; Yen, K.-H.; Xiao, F.-Y |
Showing items 1-5 of 5 (1 Page(s) Totally)
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