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Institution Date Title Author
國立交通大學 2014-12-08T15:08:08Z Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao
國立交通大學 2014-12-08T15:07:00Z Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration Liang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao

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