| 臺大學術典藏 |
2018-09-10T15:26:09Z |
A Prediction Method of Heat Generation in the Silicon Substrate for 3-D ICs
|
Y. A. Hsu;C. H. Cheng;Y. C. Lu;T. L. Wu; Y. A. Hsu; C. H. Cheng; Y. C. Lu; T. L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T15:26:09Z |
A Prediction Method of Heat Generation in the Silicon Substrate for 3-D ICs
|
Y. A. Hsu;C. H. Cheng;Y. C. Lu;T. L. Wu; Y. A. Hsu; C. H. Cheng; Y. C. Lu; T. L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T09:25:29Z |
60-GHz four-element phased-array transmit/receive system-in-package using phase compensation techniques in 65-nm flip-chip CMOS process
|
Y.-F. Lu; T.-Y. Huang; Y.-L. Chang; Y.-K. Hsieh; P.-J. Peng; I.-C. Chang; T.-C. Tsai; K.-Y. Kao; W.-Y. Hsiung; J. Wang; Y. A. Hsu; K.-Y. Lin; H.-C. Lu; Y.-C. Lin; L.-H. Lu; T.-W. Huang; R.-B. Wu; H. Wang; J.-L. Kuo; LIANG-HUNG LU et al. |
| 臺大學術典藏 |
2018-09-10T09:24:41Z |
60GHz four-element phased-array transmit/receive system-in-package using phase compensation techniques in 65nm flip-chip CMOS process
|
Y.-F. Lu; T.-Y. Huang; Y.-L. Chang; Y.-K. Hsieh; P.-J. Peng; I¡VC. Chang; T.-C. Tsai; K.-Y. Kao; N. Hsiung; J. Wang; Y. A. Hsu; K.-Y. Lin; H.-C. Lu; Y.-C. Lin; L.-H. Lu; T.-W. Huang; R.-B. Wu,; H. Wang; J.-L. Kuo; RUEY-BEEI WU et al. |
