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Institution Date Title Author
中原大學 2009-06 Improve Cooling Effect of Injection Molding by Pulsed-Cooling Method S. C. Chen; P. S. Minh; I S. Hsieh; Y. C. Chiou
中原大學 2009-06 Investigation of the Heat Hesitation in the In-Mold-Decoration Processing with the Film S. C. Chen; S. H. Tarng; C. H. Tsai; Y. C. Chiou; W. H. Yang
國立中山大學 2007 A Novel Method of Composite Electroplating on Lap in Lapping Process Y.C. Chiou; R.T. Lee; C.L. Yau
國立中山大學 2006 Lapping of Ultra-Precision Ball Surfaces Part I:Concentric V-Groove Lapping System R.T. Lee; Y.C. Hwang; Y.C. Chiou
國立中山大學 2006 Inverse Approach for Estimating Rheological Characteristics of Adsorption Layer in Thin Film EHL Contacts H.M. Chu; R.T. Lee; Y.C. Chiou
國立中山大學 2006 Lapping of Ultra-Precision Ball Surfaces Part II:Eccentric V-Groove Lapping System R.T. Lee; Y.C. Hwang; Y.C. Chiou
國立中山大學 2005 Effects of various ion-typed surfactants on silicon anisotropic etching properties in KOH and TMAH solution C.R. Yang; P.Y. Chen; C.H. Yang; Y.C. Chiou; R.T. Lee
國立中山大學 2005 Effects of mechanical agitation and surfactant additive on silicon anisotropic etching in alkaline KOH solution C.R. Yang; P.Y. Chen;C.H. Yang; Y.C. Chiou; R.T. Lee
南台科技大學 2004-01 The Monitoring System using Wireless Picture Transfer Technique 席家年; Chia-Nian Shyi; Y.-C. Chiou; J.-Y. Chen; K.-R. Huang
國立中山大學 2004 Inverse approach for calculating pressure and viscosity in pure squeeze EHL motion of circular contacts H.M. Chu;R.T. Lee; Y.C. Chiou

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