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Institution Date Title Author
元智大學 Feb-21 A Novel Ultrawideband Absorptive Common-Mode Filter Design Using a Miniaturized and Resistive Defected Ground Structure S.-K. Tseng; Cheng-Nan Chiu; Y.-C. Tsao; Y.-P. Chiou
臺大學術典藏 2018-09-10T15:26:08Z Suppression of End-fired Emission for a Miniaturized-Element Frequency-Selective Shielding Surface with Finite Size Using EBG Y.-M. Yu;C.-N. Chiu;Y.-P. Chiou;T.-L. Wu; Y.-M. Yu; C.-N. Chiu; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T15:26:08Z Suppression of End-fired Emission for a Miniaturized-Element Frequency-Selective Shielding Surface with Finite Size Using EBG Y.-M. Yu;C.-N. Chiu;Y.-P. Chiou;T.-L. Wu; Y.-M. Yu; C.-N. Chiu; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T15:26:07Z An Effective Via-Based Frequency Adjustment and Minimization Methodology for Single-Layered Frequency Selective Surfaces Y.-M. Yu;C.-N. Chiu;Y.-P. Chiou;T.-L. Wu; Y.-M. Yu; C.-N. Chiu; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T15:26:07Z An Effective Via-Based Frequency Adjustment and Minimization Methodology for Single-Layered Frequency Selective Surfaces Y.-M. Yu;C.-N. Chiu;Y.-P. Chiou;T.-L. Wu; Y.-M. Yu; C.-N. Chiu; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T15:00:30Z An Equation-Based Circuit Model and its Generation Tool for 3-D IC Power Delivery Networks with an Emphasis on Coupling Effect C.-H. Cheng;T.-Y. Cheng;C.-H. Du;Y.-C. Lu;Y.-P. Chiou;Sally Liu;T.-L. Wu; C.-H. Cheng; T.-Y. Cheng; C.-H. Du; Y.-C. Lu; Y.-P. Chiou; Sally Liu; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T15:00:30Z An Equation-Based Circuit Model and its Generation Tool for 3-D IC Power Delivery Networks with an Emphasis on Coupling Effect C.-H. Cheng;T.-Y. Cheng;C.-H. Du;Y.-C. Lu;Y.-P. Chiou;Sally Liu;T.-L. Wu; C.-H. Cheng; T.-Y. Cheng; C.-H. Du; Y.-C. Lu; Y.-P. Chiou; Sally Liu; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T15:00:30Z Very Closely Located Dual-band Frequency Selective Surfaces via Identical Resonant Elements F.-C. Huang;C.-N. Chiu;T.-L. Wu;Y.-P. Chiou; F.-C. Huang; C.-N. Chiu; T.-L. Wu; Y.-P. Chiou; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T15:00:30Z Very Closely Located Dual-band Frequency Selective Surfaces via Identical Resonant Elements F.-C. Huang;C.-N. Chiu;T.-L. Wu;Y.-P. Chiou; F.-C. Huang; C.-N. Chiu; T.-L. Wu; Y.-P. Chiou; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T09:50:40Z ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments YI-CHANG LU; TZONG-LIN WU; YIH-PENG CHIOU; Y.-P. Chiou; T.-L. Wu; P.-S. Chen; W.-C. Lo; Y.-C. Lu; C.-D. Wang;Y.-J. Chang;Y.-C. Lu;P.-S. Chen;W.-C. Lo;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-J. Chang
臺大學術典藏 2018-09-10T09:50:40Z ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments YI-CHANG LU; TZONG-LIN WU; YIH-PENG CHIOU; Y.-P. Chiou; T.-L. Wu; P.-S. Chen; W.-C. Lo; Y.-C. Lu; C.-D. Wang;Y.-J. Chang;Y.-C. Lu;P.-S. Chen;W.-C. Lo;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-J. Chang
臺大學術典藏 2018-09-10T09:25:10Z Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T09:25:10Z Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T09:25:10Z A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method YIH-PENG CHIOU; T.-Y. Cheng;C.-D. Wang;Y.-P. Chiou;T.-L. Wu; T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:25:10Z A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method YIH-PENG CHIOU; T.-Y. Cheng;C.-D. Wang;Y.-P. Chiou;T.-L. Wu; T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T08:46:52Z Accuracy-improved through-silicon-via model using conformal mapping technique T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU

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