臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
臺大學術典藏	2018-09-10T09:50:40Z	ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments	YI-CHANG LU; TZONG-LIN WU; YIH-PENG CHIOU; Y.-P. Chiou; T.-L. Wu; P.-S. Chen; W.-C. Lo; Y.-C. Lu; C.-D. Wang;Y.-J. Chang;Y.-C. Lu;P.-S. Chen;W.-C. Lo;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-J. Chang
臺大學術典藏	2018-09-10T09:25:10Z	Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes	C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏	2018-09-10T09:25:10Z	Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes	C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏	2018-09-10T09:25:10Z	A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method	YIH-PENG CHIOU; T.-Y. Cheng;C.-D. Wang;Y.-P. Chiou;T.-L. Wu; T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏	2018-09-10T09:25:10Z	A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method	YIH-PENG CHIOU; T.-Y. Cheng;C.-D. Wang;Y.-P. Chiou;T.-L. Wu; T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏	2018-09-10T08:46:52Z	Accuracy-improved through-silicon-via model using conformal mapping technique	T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU

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