臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

???ui.leftmenu.abouttair???
	???ui.leftmenu.explanation???

???ui.leftmenu.bartitle???
	Repositories
	Author
	Title
	Date
	???ui.leftmenu.statisticschart???
	???ui.leftmenu.realtimefacts???
	???ui.leftmenu.trend???

???index.news???
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

???ui.leftmenu.copyrighttitle???
	???ui.leftmenu.copyrightpublisher???
	???ui.leftmenu.copyrightconference???

???ui.leftmenu.link???
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"y s lai"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1???	???jsp.browse.items-by-author.order2???

Showing items 1-25 of 87 (4 Page(s) Totally)
1 2 3 4 > >>
View [10|25|50] records per page

Institution	Date	Title	Author
國立臺灣海洋大學	2015-01	Production and characterization of a monoclonal antibody against a late gene encoded by grouper iridovirus 64L	Z-Y Chen; PP Chiou;C-J Liou;Y-S Lai
國立臺灣海洋大學	2014-10	Identification and characterization of a late gene encoded by grouper iridovirus 2L (GIV-2L)	H-Y Lin, C-F Cheng; P P Chiou; C-J Liou; J-C Yiu; Y-S Lai
義守大學	2013-09	Rapid thermal annealing effects on the structural and nanomechanical properties of Ga-doped ZnO thin films	S.-R. Jian;G.-J. Chen;S.-K. Wang;T.-C. Lin;J.S.-C. Jang;J.-Y. Juang;Y.-S. Lai;J.-Y. Tseng
國立臺灣海洋大學	2012-08	Balanced detection spectral domain optical coherence tomography with a multiline single camera for signal-to-noise ratio enhancement	Y. S. Huang; W. C. Kuo; Y. S. Lai; C. M. Lai
元智大學	2011-10	Bulk Nanocrystalline Nd-Fe-B Magnets Solidified in Magnetic Field With Various Surface Area-to-Volume Ratios	C. Wang; Y. S. Lai; C. C. Hsieh; W. C. Chang; H. W. Chang; Sun, A. C.
元智大學	2011-06	Influence of annealing temperature on the structural, optical and mechanical properties of ALD-derived ZnO thin films	C.-Y. Yen; S.-R. Jian; G.-J. Chen; C.-M. Lin; H.-Y. Lee; W.-C. Ke; Y.-Y. Liao; P.-F. Yang; C.-T. Wang; Y.-S. Lai; Jason S.-C. Jang; J.-Y. Juang
義守大學	2011-06	Influence of annealing temperature on the structural, optical and mechanical properties of ALD-derived ZnO thin films	C-Y Yen;S.-R. Jian;G.-J. Chen;C.-M. Lin;H.-Y. Lee;W.-C. Ke;Y.-Y. Liao; P.-F. Yang;C.-T. Wang;Y.-S. Lai;Jason S.-C. Jang; J.-Y. Juang
元智大學	2011-03	Magnetic properties and microstructure of bulk Nd-Fe-B magnets solidified in magnetic field	C. Wang; Y. S. Lai; C. C. Hsieh; W.C. Chang; H. W. Chang; An-Cheng Sun
中國醫藥大學	2011	Thermal, chemical, optical properties and structure of Er3+-doped and Er3+/Yb3+-codoped P2O5–Al2O3–ZnO glasses	(S.W. Yung)*; 許世明(Shih-Ming Hsu); (C.C. Chang); (K.L. Hsu); (T.S. Chin); (H.I. Hsiang); (Y.S. Lai)
國立臺灣海洋大學	2010	Assessment of the tumorigenesis and drug susceptibility of three new canine mammary tumor cell lines	Y-S Lai;P. P. Chiou;W-J Chen;Y-H Li;J-C Yiu;Y-H Cheng;C-T Lin;C-Y Chang
國立中山大學	2009	Nonuniform and negative marker displacements induced by current crowding during electromigration in flip-chip Sn-0.7 Cu solder joints	S.W. Liang;H.Y. Hsiao;C. Chen;L. Xu;K.N. Tu;Y.S. Lai
國立中山大學	2009	First-principles calculations of elastic properties of Cu3Sn and Cu6Sn5 intermetallics	J. Chen;Y.S. Lai;P.F. Yang
國立中山大學	2009	In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation x-rays	A.T. Wu;C.Y. Tsai;C.L. Kao;M.K. Shih;Y.S. Lai;H.Y. Lee;C.S. Ku
國立中山大學	2009	Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates	C.C. Chang;Y.W. Lin;Y.S. Lai;C.R. Kao
國立中山大學	2009	Thermomigration versus electromigration in microelectronics solder joints	M.F. Abdulhamid;C. Basaran;Y.S. Lai
國立中山大學	2009	Design optimization of needle geometry for wafer-level probing test	M.K. Shih;Y.S. Lai
國立中山大學	2009	In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction	K. Chen;N. Tamura;M. Kunz;K.N. Tu;Y.S. Lai
國立中山大學	2009	Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints	M.H. R. Jen;L.C. Liu;Y.S. Lai
國立中山大學	2009	Structural and elastic properties of Cu6Sn5 and Cu3Sn from first-principles calculations	J. Chen;Y.S. Lai;P.F. Yang;C.Y. Ren;D.J. Huang
國立中山大學	2009	Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints	Y.S. Lai;C.R. Kao;H.C. Chang;C.L. Kao
國立中山大學	2009	High-speed cyclic bend tests and board-level drop tests for evaluating the robustness of solder joints in printed circuit board assemblies	E.H. Wong;S.K.W. Seah;C.S. Selvanayagam;R. Rajoo;W.D. van Driel;J.F.J.M. Caers;X.J. Zhao;N. Owens;M. Leoni;L.C. Tan;Y.S. Lai;C.L. Yeh
國立中山大學	2009	Nanotribological characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds	P.F. Yang;S.R. Jian;Y.S. Lai;R.S. Chen
國立中山大學	2009	Strain rate dependence on nanoindentation responses of interfacial intermetallic compounds in electronic solder joints with Cu and Ag substrates	J.M. Song;Y.L. Shen;C.W. Su;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder joints with Au/Ni/Cu or Cu substrate pad metallization	Y.S. Lai;Y.T. Chiu;C.W. Lee
國立中山大學	2009	Structural and mechanical characteristics of (103) AlN thin films prepared by radio frequency magnetron sputtering	P.F. Yang;S.R. Jian;S. Wu;Y.S. Lai;C.T. Wang;R.S. Chen

Showing items 1-25 of 87 (4 Page(s) Totally)
1 2 3 4 > >>
View [10|25|50] records per page

	English \| 正體中文 \| 简体中文 \| 0
	???header.visitor??? : 50693753 ???header.onlineuser??? : 214 ???header.sponsordeclaration???