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Institution	Date	Title	Author
國立臺灣海洋大學	2015-01	Production and characterization of a monoclonal antibody against a late gene encoded by grouper iridovirus 64L	Z-Y Chen; PP Chiou;C-J Liou;Y-S Lai
國立臺灣海洋大學	2014-10	Identification and characterization of a late gene encoded by grouper iridovirus 2L (GIV-2L)	H-Y Lin, C-F Cheng; P P Chiou; C-J Liou; J-C Yiu; Y-S Lai
義守大學	2013-09	Rapid thermal annealing effects on the structural and nanomechanical properties of Ga-doped ZnO thin films	S.-R. Jian;G.-J. Chen;S.-K. Wang;T.-C. Lin;J.S.-C. Jang;J.-Y. Juang;Y.-S. Lai;J.-Y. Tseng
國立臺灣海洋大學	2012-08	Balanced detection spectral domain optical coherence tomography with a multiline single camera for signal-to-noise ratio enhancement	Y. S. Huang; W. C. Kuo; Y. S. Lai; C. M. Lai
元智大學	2011-10	Bulk Nanocrystalline Nd-Fe-B Magnets Solidified in Magnetic Field With Various Surface Area-to-Volume Ratios	C. Wang; Y. S. Lai; C. C. Hsieh; W. C. Chang; H. W. Chang; Sun, A. C.
元智大學	2011-06	Influence of annealing temperature on the structural, optical and mechanical properties of ALD-derived ZnO thin films	C.-Y. Yen; S.-R. Jian; G.-J. Chen; C.-M. Lin; H.-Y. Lee; W.-C. Ke; Y.-Y. Liao; P.-F. Yang; C.-T. Wang; Y.-S. Lai; Jason S.-C. Jang; J.-Y. Juang
義守大學	2011-06	Influence of annealing temperature on the structural, optical and mechanical properties of ALD-derived ZnO thin films	C-Y Yen;S.-R. Jian;G.-J. Chen;C.-M. Lin;H.-Y. Lee;W.-C. Ke;Y.-Y. Liao; P.-F. Yang;C.-T. Wang;Y.-S. Lai;Jason S.-C. Jang; J.-Y. Juang
元智大學	2011-03	Magnetic properties and microstructure of bulk Nd-Fe-B magnets solidified in magnetic field	C. Wang; Y. S. Lai; C. C. Hsieh; W.C. Chang; H. W. Chang; An-Cheng Sun
中國醫藥大學	2011	Thermal, chemical, optical properties and structure of Er3+-doped and Er3+/Yb3+-codoped P2O5–Al2O3–ZnO glasses	(S.W. Yung)*; 許世明(Shih-Ming Hsu); (C.C. Chang); (K.L. Hsu); (T.S. Chin); (H.I. Hsiang); (Y.S. Lai)
國立臺灣海洋大學	2010	Assessment of the tumorigenesis and drug susceptibility of three new canine mammary tumor cell lines	Y-S Lai;P. P. Chiou;W-J Chen;Y-H Li;J-C Yiu;Y-H Cheng;C-T Lin;C-Y Chang
國立中山大學	2009	Nonuniform and negative marker displacements induced by current crowding during electromigration in flip-chip Sn-0.7 Cu solder joints	S.W. Liang;H.Y. Hsiao;C. Chen;L. Xu;K.N. Tu;Y.S. Lai
國立中山大學	2009	First-principles calculations of elastic properties of Cu3Sn and Cu6Sn5 intermetallics	J. Chen;Y.S. Lai;P.F. Yang
國立中山大學	2009	In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation x-rays	A.T. Wu;C.Y. Tsai;C.L. Kao;M.K. Shih;Y.S. Lai;H.Y. Lee;C.S. Ku
國立中山大學	2009	Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates	C.C. Chang;Y.W. Lin;Y.S. Lai;C.R. Kao
國立中山大學	2009	Thermomigration versus electromigration in microelectronics solder joints	M.F. Abdulhamid;C. Basaran;Y.S. Lai
國立中山大學	2009	Design optimization of needle geometry for wafer-level probing test	M.K. Shih;Y.S. Lai
國立中山大學	2009	In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction	K. Chen;N. Tamura;M. Kunz;K.N. Tu;Y.S. Lai
國立中山大學	2009	Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints	M.H. R. Jen;L.C. Liu;Y.S. Lai
國立中山大學	2009	Structural and elastic properties of Cu6Sn5 and Cu3Sn from first-principles calculations	J. Chen;Y.S. Lai;P.F. Yang;C.Y. Ren;D.J. Huang
國立中山大學	2009	Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints	Y.S. Lai;C.R. Kao;H.C. Chang;C.L. Kao
國立中山大學	2009	High-speed cyclic bend tests and board-level drop tests for evaluating the robustness of solder joints in printed circuit board assemblies	E.H. Wong;S.K.W. Seah;C.S. Selvanayagam;R. Rajoo;W.D. van Driel;J.F.J.M. Caers;X.J. Zhao;N. Owens;M. Leoni;L.C. Tan;Y.S. Lai;C.L. Yeh
國立中山大學	2009	Nanotribological characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds	P.F. Yang;S.R. Jian;Y.S. Lai;R.S. Chen
國立中山大學	2009	Strain rate dependence on nanoindentation responses of interfacial intermetallic compounds in electronic solder joints with Cu and Ag substrates	J.M. Song;Y.L. Shen;C.W. Su;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder joints with Au/Ni/Cu or Cu substrate pad metallization	Y.S. Lai;Y.T. Chiu;C.W. Lee
國立中山大學	2009	Structural and mechanical characteristics of (103) AlN thin films prepared by radio frequency magnetron sputtering	P.F. Yang;S.R. Jian;S. Wu;Y.S. Lai;C.T. Wang;R.S. Chen
國立中山大學	2009	High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys	S.T. Jenq;H.H. Chang;Y.S. Lai;T.Y. Tsai
國立中山大學	2009	Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases	J. Chen;Y.S. Lai
國立中山大學	2009	Alloying modification of Sn-Ag-Cu solders by manganese and titanium	L.W. Lin;J.M. Song;Y.S. Lai;Y.T. Chiu;N.C. Lee;J.Y. Uan
國立中山大學	2009	Guest editorial: Recent research advances in Pb-free solders	Y.S. Lai;H.M. Tong;K.N. Tu
國立中山大學	2009	Electromigration test on void formation and failure mechanism of FCBGA lead-free solder joints	M.H.R. Jen;L.C. Liu;Y.S. Lai
國立中山大學	2009	Influence of power cycling durations on thermal and fatigue reliability characteristics of board-level chip-scale packages	T.H. Wang;C.C. Lee;Y.S. Lai;K.Y. Lee
國立中山大學	2009	Advances in the drop-impact reliability of solder joints for mobile applications	E.H. Wong;S.K.W. Seah;W.D. van Driel;J.F.J.M. Caers;N. Owens;Y.S. Lai
國立中山大學	2009	Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly	T.H. Wang;Y.S. Lai;C.C. Lee;Y.C. Lin
國立中山大學	2009	Phase transformations in monocrystalline Si induced by repeated nanoindentation	Y.H. Lin;T.C. Chen;Y.S. Lai;P.F. Yang;D.L. Chen
國立中山大學	2009	Evaluation of nanomechanical properties of multi-layer SiGe-Si films	M.H. Lin;H.C. Wen;Y.S. Lai;P.F. Yang
國立中山大學	2009	Effect of trace alloying elements on the ball impact test performance of SnAgCu solder joints	Y.R. Liu;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Crack formation on Pd-plated Cu wire/Al pad interface	Y.W. Lin;Y.T. Chiu;K.L. Lin;Y.S. Lai
國立中山大學	2009	New bending algorithm for field driven molecular dynamics	D.L. Chen;T.C. Chen;Y.S. Lai
國立中山大學	2009	Numerical examinations of thermal cycling fatiguereliability of substrate through holes	T.H. Chen;T.H. Wang;Y.S. Lai
國立中山大學	2009	Ultra-long probing needle design for digital light processing wafer testing	H.Y. Chang;M.K. Shih;Y.S. Lai
國立中山大學	2009	Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications	J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Nanomechanical characterization of GaN epitaxial layers	H.C. Wen;Y.S. Lai;P.F. Yang;M.H. Lin
國立中山大學	2009	Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints	C.W. Su;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Application of molding compound viscoelastic model to ball grid array warpage prediction	H.W. Huang;T.C. Chiu;Y.S. Lai
國立中山大學	2009	Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber	T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學	2009	Self-filling die-attach epoxy for large-die-stack applications	T.Y. Tsai;H.C. Chang;Y.S. Lai;M. Todd;D. Loskot;Q. Ji;S. Gupta;F.Y. Huang
國立中山大學	2009	Electromigration reliability characterization in ASE: A state-of-the-art review	Y.S. Lai
國立中山大學	2009	Time dependent plastic deformation behavior of interfacial intermetallic compounds in solder joints	C.W. Su;J.M. Song;B.R. Huang;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Underfill study for large dice flip chip packages	A. Lin;C.Y. Li;M.K. Shih;Y.S. Lai;B. Appelt;A. Tseng

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