臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	Date
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
國立中山大學	2009	Design optimization of needle geometry for wafer-level probing test	M.K. Shih;Y.S. Lai
國立中山大學	2009	In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction	K. Chen;N. Tamura;M. Kunz;K.N. Tu;Y.S. Lai
國立中山大學	2009	Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints	M.H. R. Jen;L.C. Liu;Y.S. Lai
國立中山大學	2009	Structural and elastic properties of Cu6Sn5 and Cu3Sn from first-principles calculations	J. Chen;Y.S. Lai;P.F. Yang;C.Y. Ren;D.J. Huang
國立中山大學	2009	Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints	Y.S. Lai;C.R. Kao;H.C. Chang;C.L. Kao
國立中山大學	2009	High-speed cyclic bend tests and board-level drop tests for evaluating the robustness of solder joints in printed circuit board assemblies	E.H. Wong;S.K.W. Seah;C.S. Selvanayagam;R. Rajoo;W.D. van Driel;J.F.J.M. Caers;X.J. Zhao;N. Owens;M. Leoni;L.C. Tan;Y.S. Lai;C.L. Yeh
國立中山大學	2009	Nanotribological characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds	P.F. Yang;S.R. Jian;Y.S. Lai;R.S. Chen
國立中山大學	2009	Strain rate dependence on nanoindentation responses of interfacial intermetallic compounds in electronic solder joints with Cu and Ag substrates	J.M. Song;Y.L. Shen;C.W. Su;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder joints with Au/Ni/Cu or Cu substrate pad metallization	Y.S. Lai;Y.T. Chiu;C.W. Lee
國立中山大學	2009	Structural and mechanical characteristics of (103) AlN thin films prepared by radio frequency magnetron sputtering	P.F. Yang;S.R. Jian;S. Wu;Y.S. Lai;C.T. Wang;R.S. Chen

Showing items 16-25 of 87 (9 Page(s) Totally)
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