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Showing items 21-45 of 87 (4 Page(s) Totally)
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Institution	Date	Title	Author
國立中山大學	2009	High-speed cyclic bend tests and board-level drop tests for evaluating the robustness of solder joints in printed circuit board assemblies	E.H. Wong;S.K.W. Seah;C.S. Selvanayagam;R. Rajoo;W.D. van Driel;J.F.J.M. Caers;X.J. Zhao;N. Owens;M. Leoni;L.C. Tan;Y.S. Lai;C.L. Yeh
國立中山大學	2009	Nanotribological characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds	P.F. Yang;S.R. Jian;Y.S. Lai;R.S. Chen
國立中山大學	2009	Strain rate dependence on nanoindentation responses of interfacial intermetallic compounds in electronic solder joints with Cu and Ag substrates	J.M. Song;Y.L. Shen;C.W. Su;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder joints with Au/Ni/Cu or Cu substrate pad metallization	Y.S. Lai;Y.T. Chiu;C.W. Lee
國立中山大學	2009	Structural and mechanical characteristics of (103) AlN thin films prepared by radio frequency magnetron sputtering	P.F. Yang;S.R. Jian;S. Wu;Y.S. Lai;C.T. Wang;R.S. Chen
國立中山大學	2009	High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys	S.T. Jenq;H.H. Chang;Y.S. Lai;T.Y. Tsai
國立中山大學	2009	Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases	J. Chen;Y.S. Lai
國立中山大學	2009	Alloying modification of Sn-Ag-Cu solders by manganese and titanium	L.W. Lin;J.M. Song;Y.S. Lai;Y.T. Chiu;N.C. Lee;J.Y. Uan
國立中山大學	2009	Guest editorial: Recent research advances in Pb-free solders	Y.S. Lai;H.M. Tong;K.N. Tu
國立中山大學	2009	Electromigration test on void formation and failure mechanism of FCBGA lead-free solder joints	M.H.R. Jen;L.C. Liu;Y.S. Lai
國立中山大學	2009	Influence of power cycling durations on thermal and fatigue reliability characteristics of board-level chip-scale packages	T.H. Wang;C.C. Lee;Y.S. Lai;K.Y. Lee
國立中山大學	2009	Advances in the drop-impact reliability of solder joints for mobile applications	E.H. Wong;S.K.W. Seah;W.D. van Driel;J.F.J.M. Caers;N. Owens;Y.S. Lai
國立中山大學	2009	Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly	T.H. Wang;Y.S. Lai;C.C. Lee;Y.C. Lin
國立中山大學	2009	Phase transformations in monocrystalline Si induced by repeated nanoindentation	Y.H. Lin;T.C. Chen;Y.S. Lai;P.F. Yang;D.L. Chen
國立中山大學	2009	Evaluation of nanomechanical properties of multi-layer SiGe-Si films	M.H. Lin;H.C. Wen;Y.S. Lai;P.F. Yang
國立中山大學	2009	Effect of trace alloying elements on the ball impact test performance of SnAgCu solder joints	Y.R. Liu;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Crack formation on Pd-plated Cu wire/Al pad interface	Y.W. Lin;Y.T. Chiu;K.L. Lin;Y.S. Lai
國立中山大學	2009	New bending algorithm for field driven molecular dynamics	D.L. Chen;T.C. Chen;Y.S. Lai
國立中山大學	2009	Numerical examinations of thermal cycling fatiguereliability of substrate through holes	T.H. Chen;T.H. Wang;Y.S. Lai
國立中山大學	2009	Ultra-long probing needle design for digital light processing wafer testing	H.Y. Chang;M.K. Shih;Y.S. Lai
國立中山大學	2009	Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications	J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Nanomechanical characterization of GaN epitaxial layers	H.C. Wen;Y.S. Lai;P.F. Yang;M.H. Lin
國立中山大學	2009	Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints	C.W. Su;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Application of molding compound viscoelastic model to ball grid array warpage prediction	H.W. Huang;T.C. Chiu;Y.S. Lai

Showing items 21-45 of 87 (4 Page(s) Totally)
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