臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Showing items 36-45 of 87 (9 Page(s) Totally)
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Institution	Date	Title	Author
國立中山大學	2009	Effect of trace alloying elements on the ball impact test performance of SnAgCu solder joints	Y.R. Liu;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Crack formation on Pd-plated Cu wire/Al pad interface	Y.W. Lin;Y.T. Chiu;K.L. Lin;Y.S. Lai
國立中山大學	2009	New bending algorithm for field driven molecular dynamics	D.L. Chen;T.C. Chen;Y.S. Lai
國立中山大學	2009	Numerical examinations of thermal cycling fatiguereliability of substrate through holes	T.H. Chen;T.H. Wang;Y.S. Lai
國立中山大學	2009	Ultra-long probing needle design for digital light processing wafer testing	H.Y. Chang;M.K. Shih;Y.S. Lai
國立中山大學	2009	Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications	J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Nanomechanical characterization of GaN epitaxial layers	H.C. Wen;Y.S. Lai;P.F. Yang;M.H. Lin
國立中山大學	2009	Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints	C.W. Su;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Application of molding compound viscoelastic model to ball grid array warpage prediction	H.W. Huang;T.C. Chiu;Y.S. Lai

Showing items 36-45 of 87 (9 Page(s) Totally)
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