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Showing items 41-87 of 87 (2 Page(s) Totally)
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Institution	Date	Title	Author
國立中山大學	2009	Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications	J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Nanomechanical characterization of GaN epitaxial layers	H.C. Wen;Y.S. Lai;P.F. Yang;M.H. Lin
國立中山大學	2009	Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints	C.W. Su;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Application of molding compound viscoelastic model to ball grid array warpage prediction	H.W. Huang;T.C. Chiu;Y.S. Lai
國立中山大學	2009	Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber	T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學	2009	Self-filling die-attach epoxy for large-die-stack applications	T.Y. Tsai;H.C. Chang;Y.S. Lai;M. Todd;D. Loskot;Q. Ji;S. Gupta;F.Y. Huang
國立中山大學	2009	Electromigration reliability characterization in ASE: A state-of-the-art review	Y.S. Lai
國立中山大學	2009	Time dependent plastic deformation behavior of interfacial intermetallic compounds in solder joints	C.W. Su;J.M. Song;B.R. Huang;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Underfill study for large dice flip chip packages	A. Lin;C.Y. Li;M.K. Shih;Y.S. Lai;B. Appelt;A. Tseng
國立中山大學	2009	Characterization of cure-dependent viscoelastic behavior for molding compound and application to package warpage simulation	T.C. Chiu;J.L. Kung;Y.S. Lai
國立中山大學	2009	Phase transformations in monocrystalline Si induced by repeated nanoindentation	Y.H. Lin;T.C. Chen;Y.S. Lai;P.F. Yang;D.L. Chen
國立中山大學	2009	Evaluation of nanomechanical properties of multi-layer SiGe-Si films	M.H. Lin;H.C. Wen;Y.S. Lai;P.F. Yang
國立中山大學	2009	Effect of trace alloying elements on the ball impact test performance of SnAgCu solder joints	Y.R. Liu;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Crack formation on Pd-plated Cu wire/Al	Y.W. Lin;Y.T. Chiu;K.L. Lin;Y.S. Lai
國立中山大學	2009	New bending algorithm for field driven molecular	D.L. Chen;T.C. Chen;Y.S. Lai
國立中山大學	2009	Numerical examinations of thermal cycling fatiguereliability of substrate through holes	T.H. Chen;T.H. Wang;Y.S. Lai
國立中山大學	2009	Ultra-long probing needle design for digital light processing wafer testing	H.Y. Chang;M.K. Shih;Y.S. Lai
國立中山大學	2009	Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications	J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Nanomechanical characterization of GaN epitaxial layers	H.C. Wen;Y.S. Lai;P.F. Yang;M.H. Lin
國立中山大學	2009	Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints	C.W. Su;J.M. Song;Y.S. Lai;.T. Chiu
國立中山大學	2009	Application of molding compound viscoelastic model to ball grid array warpage prediction	H.W. Huang;T.C. Chiu;Y.S. Lai
國立中山大學	2009	Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber	T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學	2009	Self-filling die-attach epoxy for large-die-stack applications	T.Y. Tsai;H.C. Chang;Y.S. Lai;M. Todd;D. Loskot;Q. Ji;S. Gupta;F.Y. Huang
國立中山大學	2009	Electromigration reliability characterization in ASE: A state-of-the-art review	Y.S. Lai
國立中山大學	2009	Fine pitch copper wire bonding – why now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Nanoindentation creep behavior of interfacial intermetallic compounds in electronic solder joints	C.W. Su;J.M. Song;P.R. Huang;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Effect of surface roughness of silicon dies and copper heat spreaders to the thermal performance of HFCBGAs	T.H. Wang;S.N. Paisner;C.C. Lee;S. Chen;Y.S. Lai
國立中山大學	2009	Experimental investigation and finite element analysis of bump wafer probing	H.Y. Chang;W.F. Pan;M.K. Shih;Y.S. Lai
國立中山大學	2009	Effect of minor alloying additions on the BIT reliability of SnAgCu solder joints	Y.R. Liu;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	High-power-used thermal gel degradation evaluation on board-level HFCBGA subjected to reliability tests	T.H. Wang;H.Y. Chen;C.C. Lee;Y.S. Lai
國立中山大學	2009	Response prediction and verification for PCB with package due to thermal and random vibration coupling effects	B.T. Wang;F.X. Hsu;X.W. Liang;C.H. Hung;Y.S. Lai;C.L. Yeh;Y.C. Lee
國立中山大學	2009	Application of viscoelastic model for simulating process-induced warpage of ball grid array packages	J.L. Gung;H.W. Huang;T.C. Chiu;Y.S. Lai
國立中山大學	2009	Cross-sectional transmission electron microscopy studies for deformation behaviors of AlN thin films under Berkovich nanoindentation	S.R. Jian;J.S.C. Jang;G.J. Chen;H.G. Chen;Y.Y. Liao;M.R. Chen;H.L. Kao;P.F. Yang;Y.S. Lai
國立中山大學	2009	A comparison study of electromigration performance of Pb-free flip chip solder bumps	P. Su;L. Li;Y.S. Lai;Y.T. Chiu;C.L. Kao
國立中山大學	2009	Frequency dependent S-N curves for predicting drop impact robustness of Pb-free solder interconnects	X.J. Zhao;J.F.J.M. Caers;E.H. Wong;S.K.W. Seah;W.D. van Driel;N. Owen;Y.S. Lai
國立中山大學	2009	Gold stud bumps for high performance flip chip packages	W. Chen;K. Shen;A. Wang;Y.S. Lai;B. Appelt;A. Tseng
國立中山大學	2009	In situ electromigration-induced transient stress in Pb-free Sn-Cu solder joints measured by synchrotron radiation	K. Chen;N. Tamura;K.N. Tu;Y.S. Lai
國立中山大學	2009	The study of flip chip electromigration under extra high current density	Y.W. Lin;J.H. Ke;C.R. Kao;Y.S. Lai
國立中山大學	2009	Electromigration in tin-copper, tin-silver, and eutectic tin-lead flip chip solder joints	L. Xu;J. Liang;J.K. Han;Y.S. Lai;K.N. Tu
國立中山大學	2009	In situ study of electromigration-induced orientation evolution in Pb-free solder joint by synchrotron microdiffraction	K. Chen;N. Tamura;K.N. Tu;Y.S. Lai
國立中山大學	2009	Effect of current density distribution on the formation of intermetallic compounds in Pb-free solder joints	J.K. Han;L. Xu;S.W. Liang;K.N. Tu;Y.S. Lai
國立臺灣科技大學	2007	Temperature-dependent characteristics of Puse-Laser-deposited (Pb,Sr)TiO3 films at low temperatures	J.-L. WANG;Y.-S. LAI;B.-S. CHIOU;C.-C. CHOU;T.-G.-Y. LEE;H.-Y. TSENG;C.-K. JAN;H.-C. CHENG
國立中山大學	2007	Cross-Sectional Transmission Electron Microscopy Observations on the Berkovich Indentation-Induced Deformation Microstructures in GaN Thin Films	C.H. Chien;S.R. Jian;C.T. Wang;J.Y. Juang;J.C. Huang;Y.S. Lai
南台科技大學	2004-11-01	The Study of low eutectic temperature materials enhanced by Cu nano-powder for cold logistics energy storage system	李友竹; Y. S. Lai; C. C. Chang; Y. C. M. Li; J. C. Kou; W. H. Tao
國立臺灣海洋大學	2003	Establishment of cell lines from a tropical grouper, Epinephelus awoara (Temminck & Schlegel), and their susceptibility to grouper irido- and nodaviruses	Y-S Lai;J A C John;C-H Lin;I-C Guo;S-C Chen;K Fang;C-H Lin;C-Y Chang

Showing items 41-87 of 87 (2 Page(s) Totally)
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