臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Showing items 76-85 of 87 (9 Page(s) Totally)
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Institution	Date	Title	Author
國立中山大學	2009	A comparison study of electromigration performance of Pb-free flip chip solder bumps	P. Su;L. Li;Y.S. Lai;Y.T. Chiu;C.L. Kao
國立中山大學	2009	Frequency dependent S-N curves for predicting drop impact robustness of Pb-free solder interconnects	X.J. Zhao;J.F.J.M. Caers;E.H. Wong;S.K.W. Seah;W.D. van Driel;N. Owen;Y.S. Lai
國立中山大學	2009	Gold stud bumps for high performance flip chip packages	W. Chen;K. Shen;A. Wang;Y.S. Lai;B. Appelt;A. Tseng
國立中山大學	2009	In situ electromigration-induced transient stress in Pb-free Sn-Cu solder joints measured by synchrotron radiation	K. Chen;N. Tamura;K.N. Tu;Y.S. Lai
國立中山大學	2009	The study of flip chip electromigration under extra high current density	Y.W. Lin;J.H. Ke;C.R. Kao;Y.S. Lai
國立中山大學	2009	Electromigration in tin-copper, tin-silver, and eutectic tin-lead flip chip solder joints	L. Xu;J. Liang;J.K. Han;Y.S. Lai;K.N. Tu
國立中山大學	2009	In situ study of electromigration-induced orientation evolution in Pb-free solder joint by synchrotron microdiffraction	K. Chen;N. Tamura;K.N. Tu;Y.S. Lai
國立中山大學	2009	Effect of current density distribution on the formation of intermetallic compounds in Pb-free solder joints	J.K. Han;L. Xu;S.W. Liang;K.N. Tu;Y.S. Lai
國立臺灣科技大學	2007	Temperature-dependent characteristics of Puse-Laser-deposited (Pb,Sr)TiO3 films at low temperatures	J.-L. WANG;Y.-S. LAI;B.-S. CHIOU;C.-C. CHOU;T.-G.-Y. LEE;H.-Y. TSENG;C.-K. JAN;H.-C. CHENG
國立中山大學	2007	Cross-Sectional Transmission Electron Microscopy Observations on the Berkovich Indentation-Induced Deformation Microstructures in GaN Thin Films	C.H. Chien;S.R. Jian;C.T. Wang;J.Y. Juang;J.C. Huang;Y.S. Lai

Showing items 76-85 of 87 (9 Page(s) Totally)
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