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Showing items 81-87 of 87  (2 Page(s) Totally)
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Institution Date Title Author
國立中山大學 2009 Electromigration in tin-copper, tin-silver, and eutectic tin-lead flip chip solder joints L. Xu;J. Liang;J.K. Han;Y.S. Lai;K.N. Tu
國立中山大學 2009 In situ study of electromigration-induced orientation evolution in Pb-free solder joint by synchrotron microdiffraction K. Chen;N. Tamura;K.N. Tu;Y.S. Lai
國立中山大學 2009 Effect of current density distribution on the formation of intermetallic compounds in Pb-free solder joints J.K. Han;L. Xu;S.W. Liang;K.N. Tu;Y.S. Lai
國立臺灣科技大學 2007 Temperature-dependent characteristics of Puse-Laser-deposited (Pb,Sr)TiO3 films at low temperatures J.-L. WANG;Y.-S. LAI;B.-S. CHIOU;C.-C. CHOU;T.-G.-Y. LEE;H.-Y. TSENG;C.-K. JAN;H.-C. CHENG
國立中山大學 2007 Cross-Sectional Transmission Electron Microscopy Observations on the Berkovich Indentation-Induced Deformation Microstructures in GaN Thin Films C.H. Chien;S.R. Jian;C.T. Wang;J.Y. Juang;J.C. Huang;Y.S. Lai
南台科技大學 2004-11-01 The Study of low eutectic temperature materials enhanced by Cu nano-powder for cold logistics energy storage system 李友竹; Y. S. Lai; C. C. Chang; Y. C. M. Li; J. C. Kou; W. H. Tao
國立臺灣海洋大學 2003 Establishment of cell lines from a tropical grouper, Epinephelus awoara (Temminck & Schlegel), and their susceptibility to grouper irido- and nodaviruses Y-S Lai;J A C John;C-H Lin;I-C Guo;S-C Chen;K Fang;C-H Lin;C-Y Chang

Showing items 81-87 of 87  (2 Page(s) Totally)
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