臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
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Institution	Date	Title	Author
國立高雄第一科技大學	2006.01	Nanoscale deformation measurement by using the hybrid method of gray-level and holographic interferometry	C.H.Chien;Y.D.Wu;Y.T.Chiou;C.C.Hsieh;Y.C.Chen;T.P.Chen;M.L.Tsai;C.T.Wang; 謝其昌
國立中山大學	2006	Nanoscale Deformation Measurement using the Gray-level Method by Holographic Interferometry	C.H. Chien; Y.D. Wu; Y.T. Chiou; C.C. Hsieh; Y.C. Chen; T.P. Chen; M.L. Tsai; C.T. Wang
國立中山大學	2006	Stability of the warpage in a PBGA package subjected to hygro-thermal loading	C.H. Chien; T.P. Chen; Y.C. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
南台科技大學	2005-04	Interface modification in organic thin film transistors	B. T. Wu; Y. K. Su; M. L. Tu; A. C. Wang; Y. S. Chen; Y. Z. Chiou; Y. T. Chiou; C. H. Chu
國立中山大學	2004-05-16	Hygro-Thermal Buckling Of A Thin PBGA Package	C.H. Chien; T.P. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu; C.T. Wang
國立中山大學	2004	Thermo-mechanical Behaviors of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling	C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學	2003-06-02	Investigation of the Adhesion Strength of Underfill/Solder Mask/Substrate Joints Under Thermal Cycling	C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學	2003-06	Nano-scale Measurement using the Direct Gray-level Method by Holographic Interferometry	C.H. Chien; Y.D. Wu; Y.C. Chen; C.C. Hsieh; Y.T. Chiou
國立中山大學	2003	Influences of the Moisture Absorption on PBGA Package's Warpage During IR Reflow Process	C.H. Chien; Y.C. Chen; Y.T. Chiou; T.P. Chen; C.C. Hsieh; J.J. Yan; W.Z. Chen; Y.D. Wu
國立中山大學	2002	The Measurement of Interfacial Strength of IC Package by Moire Interferometry	C.H. Chien; W.Y. Lin; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立中山大學	2002	The effect of moisture o?n the interfacial adhesion of IC packages	C.H. Chien; D.J. Weng; Y.T. Chiou; M.L. Tsai; Y.C. Chen
國立中山大學	2000-06-05	Warpage Measurements of IC Package During The IR-reflow Process	C.H. Chien; Y.T. Chiou; M.L.Tsai; T.C. Hung
國立中山大學	1998	The quantitative analysis of a two-medium mixture using holographic interferometry: the determination of the size corresponding to circular- and rectangular-column voids in a two-medium mixture	C.H. Chien; Y.T. Chiou; C.C. Lee; Y.W. Liou; S.T. Chen
國立中山大學	1997	The study of Residual stress Effect on the Mode I Stress Intensity Factor in AL 6061-T6 Aluminum Plate by the Reflected Shadow Method	C.H. Chien; Y.T. Chiou
國立中山大學	1997	Extending the Laser- Specklegram Technigue to Residual Displacement Analysis of Weldment	C.H. Chien; Y.T. Chiou
國立中山大學	1996	The Application of Two-Refiactive-Index Contouring on the Contour Difference of Two Compared Specimens	C.H. Chien;Y.T. Chiou;L.H. Lin
國立中山大學	1995-11	The Reflected Shadow Method for the Study of the Stress lntensity Factor in Aluminum Plate with Residual Stress	Y.T. Chiou; C.H. Chien
國立中山大學	1994-11	The Application of Two-Refractive-Index Contouring o?n the Contour Difference of Two Compared Specimens	L.H. Lin; Y.T. Chiou; C.H. Chien
國立中山大學	1990	Numerical Evaluation of Stress Intensity Factors at Crack Tips in Weldments	C.H. Chien; H.J. Chen; Y.T. Chiou
國立中山大學	1989-12	The Analysis of Stress Field Around a Crack Tip in Weldments	C.H. Chien; H.J. Chen; Y.T. Chiou
國立中山大學	1989	The Estimation of Welding Residual Stresses by Using Simulated Inherent Strain	H.J. Chien;C.H. Chen;Y.T. Chiou
國立中山大學	1988-12	The Estimation of Welding Residual Stresses by Using Simulated Inherent Strain	C.H. Chien; H.J. Chen; Y.T. Chiou

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