臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
美和科技大學	2012	Rapid on-site multiplex assays for total and toxigenic Microcystis using real-time PCR with microwave cell disruption	A. Michinaka;H. K. Yen;Y. T. Chiu;H. W. Tsao;T. F. Lin
佛光大學	2010-07-11	Analysis and Comparison of Fish Posture by Image Processing	賴政良;S.-T. Tsai;Y.-T. Chiu
佛光大學	2010-07-11	Analysis and Comparison of Fish Posture by Image Processing	賴政良;S.-T. Tsai;Y.-T. Chiu
國立中山大學	2009	Strain rate dependence on nanoindentation responses of interfacial intermetallic compounds in electronic solder joints with Cu and Ag substrates	J.M. Song;Y.L. Shen;C.W. Su;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder joints with Au/Ni/Cu or Cu substrate pad metallization	Y.S. Lai;Y.T. Chiu;C.W. Lee
國立中山大學	2009	Alloying modification of Sn-Ag-Cu solders by manganese and titanium	L.W. Lin;J.M. Song;Y.S. Lai;Y.T. Chiu;N.C. Lee;J.Y. Uan
國立中山大學	2009	Effect of trace alloying elements on the ball impact test performance of SnAgCu solder joints	Y.R. Liu;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Crack formation on Pd-plated Cu wire/Al pad interface	Y.W. Lin;Y.T. Chiu;K.L. Lin;Y.S. Lai
國立中山大學	2009	Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints	C.W. Su;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Time dependent plastic deformation behavior of interfacial intermetallic compounds in solder joints	C.W. Su;J.M. Song;B.R. Huang;Y.S. Lai;Y.T. Chiu

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