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Institution Date Title Author
國立交通大學 2014-12-12T01:39:49Z 三維積體電路封裝中錫2.5銀微凸塊的冶金反應之研究 楊若薇; Yang, Ruo-Wei; 陳智; Chen, Chih
國立交通大學 2014-12-08T15:23:14Z Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging Yang, Ruo-Wei; Chang, Yuan-Wei; Sung, Wei-Chi; Chen, Chih

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