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| 國立交通大學 |
2019-04-03T06:44:28Z |
Feasibility Investigation of Amorphous Silicon as Release Layer in Temporary Bonding for 3-D Integration and FOWLP Scheme
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Cheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:57:14Z |
The Influence of Device Morphology on Wafer-Level Bonding with Polymer-Coated Layer
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Liang, Hao-Wen; Chen, Hsiu-Chi; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:56:32Z |
Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC Applications
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Cheng, Chuan-An; Tsai, Tsung-Yen; Huang, Yu-Hsiang; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:49Z |
An Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D Integration
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Tsai, Tsung-Yen; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:37Z |
Study of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding Technology
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Huang, Yu-Hsiang; Liang, Hao-Wen; Cheng, Chuan-An; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:09Z |
Wafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC Application
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Cheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chicn-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng |
| 東海大學 |
2017 |
羅西尼四首〈我沉默地怨懟〉歌曲之研究與詮釋
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楊善淳; YANG, SHAN-CHUN |
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