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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:15:51Z	Effect of al trace dimension on electromigration failure time of flip-chip solder joints	Chiu, S. H.; Chen, Chih; Yao, D. J.
國立交通大學	2014-12-08T15:11:33Z	Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints	Chang, Y. W.; Chiu, S. H.; Chen, Chih; Yao, D. J.

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