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Showing items 1111-1117 of 1117 (112 Page(s) Totally)
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| 臺大學術典藏 |
2018-09-10T14:58:46Z |
EWOD microfluidic systems for biomedical applications
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Shen, H.-H.; Fan, S.-K.; Kim, C.-J.; Yao, D.-J.; SHIH-KANG FAN |
| 臺大學術典藏 |
2018-09-10T14:57:53Z |
24.5 A 0.5V 1.27mW nose-on-a-chip for rapid diagnosis of ventilator-associated pneumonia
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CHIA-HSIANG YANG et al.; Tang, K.-T.; Chiu, S.-W.; Shih, C.-H.; Chang, C.-L.; Yang, C.-M.; Yao, D.-J.; Wang, J.-H.; Huang, C.-M.; Chen, H.; Chang, K.-H.; Hsieh, C.-C.; Chang, T.-H.; Chang, M.-F.; Wang, C.-M.; Liu, Y.-W.; Chen, T.-J.; Yang, C.-H.; Chiueh, H.; Shyu, J.-M. |
| 國立交通大學 |
2014-12-08T15:43:16Z |
Successful recovery of human viable spermatozoa with curve-straight channel microfluidic system device
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Huang, H.; Yao, D. J.; Huang, H. J.; Li, J. R.; Fan, S. K.; Wang, M. L.; Yung-Kuei, S. |
| 國立交通大學 |
2014-12-08T15:24:57Z |
Joule heating effect under accelerated electromigration in flip-chip solder joints
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Chiu, S. H.; Liang, S. W.; Chen, Chili; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:19:45Z |
INVESTIGATION OF JOULE HEATING EFFECT IN VARIOUS STAGES OF FAILURE IN FLIP-CHIP SOLDER JOINTS UNDER ACCELERATED ELECTROMIGRATION
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Hsiao, Hsiang Yao; Chen, Chih; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:15:51Z |
Effect of al trace dimension on electromigration failure time of flip-chip solder joints
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Chiu, S. H.; Chen, Chih; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:11:33Z |
Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints
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Chang, Y. W.; Chiu, S. H.; Chen, Chih; Yao, D. J. |
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