臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2024-08	Enhancing void reduction in direct copper bonding through electroless nickel coating on alumina substrates	Chang;Fu-Wei;Lee;Yao-Jung;Hsiang;Hsing-I
國立成功大學	2024-03-01	Fabrication of Cu2-xO thin films directly bondable to copper on aluminum nitride substrates using the sol-gel method	Wan;Kuang-Heng;Lee;Yao-Jung;Hsiang;Hsing-;I

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