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"yao wen chang"的相關文件
顯示項目 36-45 / 348 (共35頁) << < 1 2 3 4 5 6 7 8 9 10 > >> 每頁顯示[10|25|50]項目
| 臺大學術典藏 |
2020-06-16T06:31:36Z |
Simultaneous functional and timing ECO.
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Chang, Hua-Yu;Jiang, Iris Hui-Ru;Chang, Yao-Wen; Chang, Hua-Yu; Jiang, Iris Hui-Ru; Chang, Yao-Wen; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:36Z |
TSV-aware analytical placement for 3D IC designs.
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Hsu, Meng-Kai;Chang, Yao-Wen;Balabanov, Valeriy; Hsu, Meng-Kai; Chang, Yao-Wen; Balabanov, Valeriy; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:35Z |
BIST design optimization for large-scale embedded memory cores.
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Chien, Tzuo-Fan;Chao, Wen-Chi;Li, James Chien-Mo;Chang, Yao-Wen;Liao, Kuan-Yu;Chang, Ming-Tung;Tsai, Min-Hsiu;Tseng, Chih-Mou; Chien, Tzuo-Fan; Chao, Wen-Chi; Li, James Chien-Mo; Chang, Yao-Wen; Liao, Kuan-Yu; Chang, Ming-Tung; Tsai, Min-Hsiu; Tseng, Chih-Mou; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:35Z |
An efficient pre-assignment routing algorithm for flip-chip designs.
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Lee, Po-Wei;Lin, Chung-Wei;Chang, Yao-Wen;Shen, Chin-Fang;Tseng, Wei-Chih; Lee, Po-Wei; Lin, Chung-Wei; Chang, Yao-Wen; Shen, Chin-Fang; Tseng, Wei-Chih; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:35Z |
Simultaneous layout migration and decomposition for double patterning technology.
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Hsu, Chin-Hsiung;Chang, Yao-Wen;Nassif, Sani R.; Hsu, Chin-Hsiung; Chang, Yao-Wen; Nassif, Sani R.; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:35Z |
Voltage-drop aware analytical placement by global power spreading for mixed-size circuit designs.
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Chuang, Yi-Lin;Lee, Po-Wei;Chang, Yao-Wen; Chuang, Yi-Lin; Lee, Po-Wei; Chang, Yao-Wen; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:34Z |
ILP-based pin-count aware design methodology for microfluidic biochips.
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Lin, Cliff Chiung-Yu;Chang, Yao-Wen; Lin, Cliff Chiung-Yu; Chang, Yao-Wen; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:34Z |
Spare-cell-aware multilevel analytical placement.
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Jiang, Zhe-Wei;Hsu, Meng-Kai;Chang, Yao-Wen;Chao, Kai-Yuan; Jiang, Zhe-Wei; Hsu, Meng-Kai; Chang, Yao-Wen; Chao, Kai-Yuan; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:34Z |
Thermal-driven analog placement considering device matching.
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Lin, Mark Po-Hung;Zhang, Hongbo;Wong, Martin D. F.;Chang, Yao-Wen; Lin, Mark Po-Hung; Zhang, Hongbo; Wong, Martin D. F.; Chang, Yao-Wen; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:34Z |
Flip-chip routing with unified area-I/O pad assignments for package-board co-design.
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Fang, Jia-Wei;Wong, Martin D. F.;Chang, Yao-Wen; Fang, Jia-Wei; Wong, Martin D. F.; Chang, Yao-Wen; YAO-WEN CHANG |
顯示項目 36-45 / 348 (共35頁) << < 1 2 3 4 5 6 7 8 9 10 > >> 每頁顯示[10|25|50]項目
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