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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立臺灣科技大學 2008 Interfacial Reactions of Pure Sn and Sn-3.0Ag-0.5Cu Lead-free Solders with the Fe-42Ni Substrate Yu-Ping Hsieh;Wei-Kai Liou;Yee-Wen Yen
國立臺灣科技大學 2008 Aging effects on interfacial reactions between Sn-9Zn+Cu alloys and Au substrat Wei-kai Liou;Yee-wen Yen
國立臺灣科技大學 2007 Electro-Enhanced Metalorganic Chemical Vapor Deposition of Copper Films Yu-Lin Kuo; Chiapyng Lee; Gene Chen; Kou-Liang Liu; Yee-Wen Yen
國立臺灣科技大學 2007 Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor-liquid crystal display applications Yee-Wen Yen; Yu-Lin Kuo; Jian-Yu Chen; Chiapyng Lee; Chung-Yu Lee
國立臺灣科技大學 2007 A DSC Study on the Kinetics of Disproportionation Reaction of (hfac)CuI(COD) Gene Chen; Chiapyng Lee; Yu-Lin Kuo; Yee Wen Yen
國立臺灣科技大學 2006 A Novel Two-Step MOCVD for Producing Thin Copper Films with a Mixture of Ethyl Alcohol and Water as the Additive Hsin-Hung Lee; Chiapyng Lee; Yu-Lin Kuo; Yee-Wen Yen
國立臺灣科技大學 2005 Reaction Mechanism of the Two-Step MOCVD of Copper Thin Film Using Cu(hfac)2?H2O Source Chiapyng Lee; Hsin-Hung Lee; Yee-Wen Yen; Yu-Lin Kuo
國立臺灣科技大學 2005 Evaluation of the Thermal Stability of Reactively Sputtered (Ti,Zr)Nx Nano-Thin Films as Diffusion Barriers Between Cu and Silicon Yu-Lin Kuo; Chiapyng Lee; Jing-Cheng Lin; Yee-Wen Yen; Wen-Horng Lee
中原大學 1995 Titanium Deposition on the Alumina Particles by Using CVD-FBR Technology Chih-chi Chen;Sinn-wen Chen;Yee-wen Yen;

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