臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立臺灣科技大學	2008	Interfacial Reactions of Pure Sn and Sn-3.0Ag-0.5Cu Lead-free Solders with the Fe-42Ni Substrate	Yu-Ping Hsieh;Wei-Kai Liou;Yee-Wen Yen
國立臺灣科技大學	2008	Aging effects on interfacial reactions between Sn-9Zn+Cu alloys and Au substrat	Wei-kai Liou;Yee-wen Yen
國立臺灣科技大學	2007	Electro-Enhanced Metalorganic Chemical Vapor Deposition of Copper Films	Yu-Lin Kuo; Chiapyng Lee; Gene Chen; Kou-Liang Liu; Yee-Wen Yen
國立臺灣科技大學	2007	Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor-liquid crystal display applications	Yee-Wen Yen; Yu-Lin Kuo; Jian-Yu Chen; Chiapyng Lee; Chung-Yu Lee
國立臺灣科技大學	2007	A DSC Study on the Kinetics of Disproportionation Reaction of (hfac)CuI(COD)	Gene Chen; Chiapyng Lee; Yu-Lin Kuo; Yee Wen Yen
國立臺灣科技大學	2006	A Novel Two-Step MOCVD for Producing Thin Copper Films with a Mixture of Ethyl Alcohol and Water as the Additive	Hsin-Hung Lee; Chiapyng Lee; Yu-Lin Kuo; Yee-Wen Yen
國立臺灣科技大學	2005	Reaction Mechanism of the Two-Step MOCVD of Copper Thin Film Using Cu(hfac)2?H2O Source	Chiapyng Lee; Hsin-Hung Lee; Yee-Wen Yen; Yu-Lin Kuo
國立臺灣科技大學	2005	Evaluation of the Thermal Stability of Reactively Sputtered (Ti,Zr)Nx Nano-Thin Films as Diffusion Barriers Between Cu and Silicon	Yu-Lin Kuo; Chiapyng Lee; Jing-Cheng Lin; Yee-Wen Yen; Wen-Horng Lee
中原大學	1995	Titanium Deposition on the Alumina Particles by Using CVD-FBR Technology	Chih-chi Chen;Sinn-wen Chen;Yee-wen Yen;

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