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机构 日期 题名 作者
國立交通大學 2014-12-08T15:25:48Z Fabrication of thin-film transistors on plastic substrates by spin etching and device transfer process Wang, SC; Hsu, CT; Yeh, CF; Lou, JC
國立交通大學 2014-12-08T15:25:27Z A new observation of the germanium outdiffusion effect on the hot carrier and NBTI reliabilities in sub-100nm technology strained-Si/SiGe CMOS devices Chung, SS; Liu, YR; Yeh, CF; Wu, SR; Lai, CS; Chang, TY; Ho, JH; Liu, CY; Huang, CT; Tsai, CT; Shiau, WT; Sun, SW
國立交通大學 2014-12-08T15:18:03Z Pentacene-based thin film transistors used to drive a twist-nematic liquid crystal display Wang, YW; Cheng, HL; Wang, YK; Hu, TH; Ho, JC; Lee, CC; Lei, TF; Yeh, CF
國立交通大學 2014-12-08T15:05:01Z INVESTIGATION OF THERMAL COEFFICIENT FOR POLYCRYSTALLINE SILICON THERMAL SENSOR DIODE YEH, CF; LIN, SS; YANG, GP
國立交通大學 2014-12-08T15:04:55Z THE NOVEL PREPARATION OF P-N-JUNCTION MESA DIODES BY SILICON-WAFER DIRECT BONDING (SDB) YEH, CF; SHYANG, HL
國立交通大學 2014-12-08T15:04:47Z THE EFFECT OF TEMPERATURE ON I-V-CHARACTERISTICS OF A-SI-H PHOTODIODE CHANG, KL; YEH, CF
國立交通大學 2014-12-08T15:04:31Z THE CHARACTERIZATION OF AL2O3 PREPARED BY ANODIC-OXIDATION YEH, CF; CHENG, JY; LU, JH
國立交通大學 2014-12-08T15:04:25Z NOVEL TECHNIQUE FOR SIO2 FORMED BY LIQUID-PHASE DEPOSITION FOR LOW-TEMPERATURE PROCESSED POLYSILICON TFT YEH, CF; LIN, SS; CHEN, CL; YANG, YC
國立交通大學 2014-12-08T15:04:20Z EXPERIMENTAL COMPARISON OF OFF-STATE CURRENT BETWEEN HIGH-TEMPERATURE-PROCESSED AND LOW-TEMPERATURE-PROCESSED UNDOPED CHANNEL POLYSILICON THIN-FILM TRANSISTORS YEH, CF; YANG, TZ; CHEN, CL; CHEN, TJ; YANG, YC
國立交通大學 2014-12-08T15:04:20Z INVESTIGATION OF SI-SIO2 INTERFACE PROPERTIES FOR BONDED SILICON-ON-INSULATOR YEH, CF; KAO, HW; CHANG, BS; CHANG, KL
國立交通大學 2014-12-08T15:04:13Z IMPROVED IV-CHARACTERISTICS OF POLYSILICON THIN-FILM TRANSISTORS WITH NOVEL DUAL-BUFFER DRAIN STRUCTURE YEH, CF; CHERN, CH
國立交通大學 2014-12-08T15:04:07Z PERFORMANCE AND OFF-STATE CURRENT MECHANISMS OF LOW-TEMPERATURE PROCESSED POLYSILICON THIN-FILM TRANSISTORS WITH LIQUID-PHASE DEPOSITED SIO2 GATE INSULATOR YEH, CF; LIN, SS; YANG, TZ; CHEN, CL; YANG, YC
國立交通大學 2014-12-08T15:04:04Z LOW-TEMPERATURE-PROCESSED POLY-SI THIN-FILM TRANSISTORS USING SOLID-PHASE-CRYSTALLIZED AND LIQUID-PHASE-DEPOSITED GATE OXIDE YEH, CF; CHEN, CL; YANG, YC; LIN, SS; YANG, TZ; HONG, TY
國立交通大學 2014-12-08T15:03:56Z ROOM-TEMPERATURE SELECTIVE GROWTH OF DIELECTRIC FILMS BY LIQUID-PHASE DEPOSITION YEH, CF; CHEN, CL
國立交通大學 2014-12-08T15:03:43Z THE PHYSICOCHEMICAL PROPERTIES AND GROWTH-MECHANISM OF OXIDE (SIO2-XFX) BY LIQUID-PHASE DEPOSITION WITH H2O ADDITION ONLY YEH, CF; CHEN, CL; LIN, GH
國立交通大學 2014-12-08T15:03:33Z CHARACTERISTICS OF SELF-INDUCED LIGHTLY-DOPED-DRAIN POLYCRYSTALLINE SILICON THIN-FILM TRANSISTORS WITH LIQUID-PHASE DEPOSITION SIO2 AS GATE-INSULATOR AND PASSIVATION-LAYER YEH, CF; YANG, TZ; CHEN, TJ
國立交通大學 2014-12-08T15:03:31Z BOND-STRUCTURE CHANGES OF LIQUID-PHASE DEPOSITED OXIDE (SIO2-XFX) ON N2 ANNEALING YEH, CF; CHEN, CL; LUR, W; YEN, PW
國立交通大學 2014-12-08T15:03:22Z FABRICATION OF MOSFETS USING LOW-TEMPERATURE LIQUID-PHASE DEPOSITED OXIDE YEH, CF; LIN, SS; HONG, TY
國立交通大學 2014-12-08T15:03:17Z LOW-TEMPERATURE PROCESSED MOSFETS WITH LIQUID-PHASE DEPOSITED SIO2-XFX AS GATE INSULATOR YEH, CF; LIN, SS; HONG, TY
國立交通大學 2014-12-08T15:03:16Z EFFECTS OF PLASMA TREATMENT ON THE PROPERTIES OF ROOM-TEMPERATURE LIQUID-PHASE DEPOSITED (LPD) OXIDE-FILMS YEH, CF; LIN, SS
國立交通大學 2014-12-08T15:03:11Z CHARACTERIZATION OF THE CHEMICAL-MECHANICAL POLISHING PROCESS-BASED ON NANOINDENTATION MEASUREMENT OF DIELECTRIC FILMS LIU, CW; DAI, BT; YEH, CF
國立交通大學 2014-12-08T15:03:10Z CONTROLLING FLUORINE CONCENTRATION AND THERMAL ANNEALING EFFECT ON LIQUID-PHASE DEPOSITED SIO2-XFX FILMS YEH, CF; CHEN, CL
國立交通大學 2014-12-08T15:03:07Z THINNER LIQUID-PHASE DEPOSITED OXIDE FOR POLYSILICON THIN-FILM TRANSISTORS YEH, CF; LIN, SS; FAN, CL
國立交通大學 2014-12-08T15:03:02Z Chemical mechanical polishing of PSG and BPSG dielectric films: The effect of phosphorus and boron concentration Liu, CW; Dai, BT; Yeh, CF
國立交通大學 2014-12-08T15:02:52Z Modeling of the wear mechanism during chemical-mechanical polishing Liu, CW; Dai, BT; Tseng, WT; Yeh, CF

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