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"yeh ecc"
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| 國立交通大學 |
2014-12-08T15:17:41Z |
Relieving the current crowding effect in flip-chip solder joints during current stressing
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Liang, SW; Shao, TL; Chen, C; Yeh, ECC; Tu, KN |
| 國立交通大學 |
2014-12-08T15:16:40Z |
Temperature and current-density distributions in flip-chip solder joints with Cu traces
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Hsu, CY; Yao, DJ; Liang, SW; Chen, C; Yeh, ECC |
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