臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:17:41Z	Relieving the current crowding effect in flip-chip solder joints during current stressing	Liang, SW; Shao, TL; Chen, C; Yeh, ECC; Tu, KN
國立交通大學	2014-12-08T15:16:40Z	Temperature and current-density distributions in flip-chip solder joints with Cu traces	Hsu, CY; Yao, DJ; Liang, SW; Chen, C; Yeh, ECC

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