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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 臺大學術典藏 |
2009-01-06T01:29:50Z |
Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package
|
Yen, Shiu-Fang; Chuang, Tung-Han; Chuang, Tung-Han; Yen, Shiu-Fang |
| 國立臺灣大學 |
2006 |
Sn3Ag0.5Cu無鉛銲錫添加稀土元素Ce之球格陣列構裝界面反應與錫鬚成長研究
|
顏秀芳; Yen, Shiu-Fang |
| 國立臺灣大學 |
2006 |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min |
| 國立臺灣大學 |
2006 |
Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package
|
Chuang, Tung-Han; Yen, Shiu-Fang |
| 臺大學術典藏 |
2006 |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min; Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min |
Showing items 1-5 of 5 (1 Page(s) Totally)
1
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