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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立臺灣科技大學 2018 Impurity-induced unusual microstructural evolution and mechanical property in Sn/Cu solder joints Hsu H.-L.; Lee H.; Wu P.-H.; Yen Y.-W.; Chen C.-M.
國立臺灣科技大學 2018 Investigation of the phase equilibria at 773 K and metallic glass regions in the Ag-Al-Zr ternary system Hsiao H.-M.; Lan Y.-C.; Hermana G.N.; Chen H.; Yen Y.-W.
嘉南藥理大學 2015-10 Inhibition of melanogenesis by beta-caryophyllene from lime mint essential oil in mouse B16 melanoma cells Yang, C. -H.; Huang, Y. -C.; Tsai, M. -L.; Cheng, C. -Y.; Liu, L. -L.; Yen, Y. -W.; Chen, W. -L.
國立臺灣科技大學 2015 A Novel Electronic Packaging Method to Replace High-Temperature Sn-Pb Solders Yen, Y.-W.;Hsiao, H.-M.;Shao, P.-S.;Chang, Y.W.
國立臺灣科技大學 2014 Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate Yen, Y.-W.;Syu, R.-S.;Chen, C.-M.;Jao, C.-C.;Chen, G.-D.
國立臺灣科技大學 2014 Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation Diyatmika, W.;Chu, J.P.;Yen, Y.W.;Chang, W.Z.;Hsueh, C.H.
國立臺灣科技大學 2014 Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain Lin, C.-P.;Chen, C.-M.;Yen, Y.-W.
國立臺灣科技大學 2014 Interfacial reactions of high-Bi alloys on various substrates Wang, J.-Y.;Chen, C.-M.;Yen, Y.-W.
國立臺灣科技大學 2014 Interfacial reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn lead-free solders with Fe-42Ni substrates Yen, Y.-W.;Hsieh, Y.-P.;Jao, C.-C.;Chiu, C.-W.;Li, Y.-S.
國立臺灣科技大學 2013 Sn whisker mitigation by a thin metallic-glass underlayer in Cu-Sn Diyatmika, W.;Chu, J.P.;Yen, Y.W.;Hsueh, C.H.

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