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Showing items 11-20 of 54 (6 Page(s) Totally)
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| 國立臺灣科技大學 |
2013 |
Investigation of interfacial reactions in the Sn/Fe-xNi couple
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Yen, Y.-W.;Chen, B.-J.;Li, Y.-S. |
| 國立臺灣科技大學 |
2013 |
Effects of annealing on Sn whisker formation: Role of Cu alloy seed layer
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Diyatmika, W.;Chu, J.P.;Yen, Y.W. |
| 國立臺灣科技大學 |
2013 |
Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods
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Yen, Y.-W.;Hsiao, H.-M.;Lo, S.-C.;Fu, S.-M. |
| 國立臺灣科技大學 |
2013 |
Aging and Cu concentration effects on Sn-9Zn-xCu/Au couples
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Yen, Y.-W.;Liou, W.-K.;Chen, W.-C.;Chiu, C.-W. |
| 國立臺灣科技大學 |
2012 |
Dissolution behaviors of the Ni and Ni3Sn4 phase in molten lead-free solders
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Yen, Y.-W.;Kuo, M.-H.;Liou, W.-K.;Chu, T.-N. |
| 國立臺灣科技大學 |
2012 |
Phase equilibria of the Sn-Bi-Cu ternary system in advanced microelectronic packaging
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Yen, Y.-W.;Hsiao, H.-M.;Jhang, G.-J.;Shi, H.-W.;Huang, M.-K. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates
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Yen, Y.-W.;Tsai, P.-H.;Fang, Y.-K.;Chen, B.-J.;Lee, C. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions in Sn/Fe-xNi couples
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Yen, Y.-W.;Hsiao, H.-M.;Lin, S.-W.;Huang, P.-J.;Lee, C. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions between Sn-Zn alloys and Au substrate
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Yen, Y.-W.;Lin, M.-C.;Lin, C.-K.;Chen, W.-C. |
| 國立臺灣科技大學 |
2012 |
Foreword
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Chen, C.-M.;Flandorfer, H.;Chen, S.-W.;Lee, J.-H.;Yen, Y.-W.;Schmetterer, C.;Ohnuma, I.;Wang, C.-H. |
Showing items 11-20 of 54 (6 Page(s) Totally)
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