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Showing items 46-54 of 54 (3 Page(s) Totally)
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| 國立臺灣科技大學 |
2007 |
A DSC study on the kinetics of disproportionation reaction of (hfac)CuI(COD)
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Chen, G.;Lee, C.;Kuo, Y.-L.;Yen, Y.-W. |
| 國立臺灣科技大學 |
2007 |
Electroenhanced metallorganic chemical vapor deposition of copper films
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Kuo, Y.-L.;Lee, C.;Chen, G.;Liu, K.-L.;Yen, Y.-W. |
| 國立臺灣科技大學 |
2007 |
Investigation of the phase equilibria of Sn-Cu-Au ternary and Ag-Sn-Cu-Au quaternary systems and interfacial reactions in Sn-Cu/Au couples
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Yen, Y.-W.;Jao, C.-C.;Hsiao, H.-M.;Lin, C.-Y.;Lee, C. |
| 國立臺灣科技大學 |
2007 |
Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate
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Yen, Y.-W.;Liou, W.-K. |
| 國立臺灣科技大學 |
2007 |
A DSC study on the kinetics of disproportionation reaction of (hfac)Cu-I(COD)
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Chen, G.;Lee, C.;Kuo, Y.L.;Yen, Y.W. |
| 國立臺灣科技大學 |
2006 |
The activation effect of Pd nanoparticles on electroless nickel-phosphorous deposition
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Kuo, L.-C.;Huang, Y.-C.;Lee, C.-L.;Yen, Y.-W. |
| 國立臺灣科技大學 |
2006 |
Mesoporous, self-assembled palladium nanospheres: High efficiency activator for electroless nickel deposition
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Lee, C.-L.;Kuo, L.-C.;Huang, Y.-C.;Yen, Y.-W. |
| 國立臺灣科技大學 |
2006 |
A novel two-step MOCVD for producing thin copper films with a mixture of ethyl alcohol and water as the additive
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Lee, H.H.;Lee, C.;Kuo, Y.L.;Yen, Y.W. |
| 國立臺灣科技大學 |
2005 |
Reaction mechanism of the two-step MOCVD of copper thin film using Cu(hfac)(2)center dot H2O source
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Lee, C.;Lee, H.H.;Yen, Y.W.;Kuo, Y.L. |
Showing items 46-54 of 54 (3 Page(s) Totally)
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