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Showing items 16-25 of 54  (6 Page(s) Totally)
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Institution Date Title Author
國立臺灣科技大學 2012 Phase equilibria of the Sn-Bi-Cu ternary system in advanced microelectronic packaging Yen, Y.-W.;Hsiao, H.-M.;Jhang, G.-J.;Shi, H.-W.;Huang, M.-K.
國立臺灣科技大學 2012 Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates Yen, Y.-W.;Tsai, P.-H.;Fang, Y.-K.;Chen, B.-J.;Lee, C.
國立臺灣科技大學 2012 Interfacial reactions in Sn/Fe-xNi couples Yen, Y.-W.;Hsiao, H.-M.;Lin, S.-W.;Huang, P.-J.;Lee, C.
國立臺灣科技大學 2012 Interfacial reactions between Sn-Zn alloys and Au substrate Yen, Y.-W.;Lin, M.-C.;Lin, C.-K.;Chen, W.-C.
國立臺灣科技大學 2012 Foreword Chen, C.-M.;Flandorfer, H.;Chen, S.-W.;Lee, J.-H.;Yen, Y.-W.;Schmetterer, C.;Ohnuma, I.;Wang, C.-H.
國立臺灣科技大學 2011 Interfacial reactions between high-Pb solders and Ag Lin, C.P.;Chen, C.M.;Yen, Y.W.;Wu, H.J.;Chen, S.W.
國立臺灣科技大學 2011 ACF particle distribution in COG process Yen, Y.W.;Lee, C.Y.
國立臺灣科技大學 2011 Substrate Shape Effect on the Sn Whisker Growth in the Electroplating Matte Sn System Yen, Y.W.;Li, C.K.;Tsou, M.Y.;Shao, P.S.
國立臺灣科技大學 2011 Investigation of Interfacial Reactions and Sn Whisker Formation in the Matte Sn Layer with NiP/Ni/Cu and Ni/Cu Multilayer Systems Yen, Y.W.;Liou, W.K.;Jao, C.C.
國立臺灣科技大學 2010 Interfacial reactions of pure Sn, Sn-3.0Ag-0.5Cu and Sn-9.0Zn lead-free solders with the Fe-42Ni substrate Hsieh Y.-P.; Jao C.-C.; Yen Y.-W.

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